Hostname: page-component-76fb5796d-25wd4 Total loading time: 0 Render date: 2024-04-26T10:09:26.767Z Has data issue: false hasContentIssue false

Metal-Ferroelectric-Semiconductor Characteristics of BaMgF4 Films on p-Silicon

Published online by Cambridge University Press:  15 February 2011

T. S. Kalkur
Affiliation:
Microelectronics Research Laboratories, Department of Electrical and Computer Engineering, University of Colorado at Colorado Springs, CO 80933
J. R. Kulkarni
Affiliation:
Presently with National Semiconductors, Santa Clara, CA.
R. Y. Kwor
Affiliation:
Microelectronics Research Laboratories, Department of Electrical and Computer Engineering, University of Colorado at Colorado Springs, CO 80933
L. Levinson
Affiliation:
Department of Physics, University of Colorado at Colorado Springs, CO 80933
L. Kammerdiner
Affiliation:
Ramtron Corporation, Colorado Springs.
Get access

Abstract

Capacitance-voltage characterstics of BaMgF4 film deposited in an ion-assisted deposition system shows hysteresis and the direction of hysteresis corresponds to ferroelectric polarization. Electrical characterization of the films shows that these films can be used to implement non-destructive read-out non-volatile ferroelectric memories. These films were found to dissolve in water and other aqueous solutions. In order to overcome this problem, a suitable capping layer like zirconium oxide and amorphous silicon was deposited on BMF films. The shift in threshold voltage did not change significantly due to the incorporation of the capping layer. The shift in threshold voltage was found to be temperature dependent and this might be due to ionic conduction in fluorides.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Eaton, S.S., Butler, D.B., Parris, M., Wilson, D. and McNeille, H., Proc. Intl. Solid State Circuits Conf., San Fransisco, CA, Feb. 1988.Google Scholar
2. Scott, J.F., Kammerdiner, L., Parris, M., Trayner, S., Ottenbachar, V., Shawbkeh, A. and Oliver, W.C., J. Appl. Phys. 64(2),787 (1988).Google Scholar
3. Araujo, C.A. and Taylor, G.W., Ferroelectrics, vol.116, 215 (1991).Google Scholar
4. Nishi, Yoshoi and Iizuka, Hisakazu, Silicon Integrated Circuits, part A, 121 (1981).Google Scholar
5. Kalkur, T.S., Argos, George and Kammerdiner, L., MRS Proceedings, vol.200, 313 (1990).Google Scholar
6. Kalkur, T.S., Kulkarni, J.R., Lu, Y.C., Rowe, M., Han, W. and Kammerdiner, L., Ferroelectrics, vol.116, 135 (1991).Google Scholar
7. Shohata, N., Matsubara, S., Miyasaka, Y. and Yonezawa, M., Proc. of 6th IEEE Intl. Symp. Appl. Ferroelectric, edited by Wood, V.E., New York, 580584 (1986).Google Scholar
8. Kalkur, T.S., Kulkarni, J.R., Kwor, R.Y., Levinson, L. and Kammerdiner, L., presented in 3rd Integrated Ferroelectrics Conference, Colorado Springs, 1991.Google Scholar
9. Francombe, M.H. and Krisnaswamy, S.V., MRS Proceedings, vol.200, 179 (1990).Google Scholar
10. Buhay, H., Sinharoy, S., Kasner, W.H., Francombe, M.H., Lampe, D.R. and Stepke, E., Proc. 7th Symp. on Applications of Ferroelectrics, University of Illinois at Urbana-Champion, June 6–8 (1990).Google Scholar
11. DiDomenico, M. Jr., Eibschutz, M., Guggenheim, H.J. and Camlibel, I., Solid State Communications, 7, 1119 (1969).Google Scholar