Hostname: page-component-77c89778f8-9q27g Total loading time: 0 Render date: 2024-07-17T21:50:45.758Z Has data issue: false hasContentIssue false

Mechanical Properties, Fracture Behavior, and Grainboundary Chemistry of B-Doped Nial

Published online by Cambridge University Press:  28 February 2011

E. P. George
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
C. T. Liu
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
J. J. Liao
Affiliation:
Materials Engineering Department, Auburn University, Auburn, AL 36849
Get access

Abstract

This paper summarizes the results of our work aimed at overcoming the intrinsic grainboundary weakness of NiAI by microalloying with boron. In previous work we have shown that 300 wppm boron is very effective in suppressing intergranular fracture in NiAI [1]. It does this by segregating strongly to the grain boundaries and strengthening them. Despite this dramatic effect on the fracture mode, however, boron is unable to improve ductility because it is a potent solid solution strengthener, more than doubling the yield strength relative to that of undoped NiA1. The present work attempts to decrease this deleterious hardening effect by lowering the bulk concentration of boron in NiA1. Our results show that if the boron concentration in the bulk is lowered to 30 wppm, the yield strength of boron-doped NiA1 is only about 30% higher than that of undoped NiAI. In addition, there is enough boron at the grain boundaries of this alloy to suppress intergranular fracture. Under these conditions, boron-doped NiAI has a tensile ductility of 2%, which is essentially identical to that of undoped NiA1. This result, namely that the strengthening of grain boundaries by boron does not by itself improve ductility, indicates that although grain boundaries might well be the weakest links in NiAI, cleavage planes are not much stronger. In other words, even though boron additions serve to strengthen the grain boundaries and suppress intergranular fracture, ductility is not improved, because the next brittle fracture mode, namely transgranular cleavage, takes over before significant plastic deformation can occur.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. George, E. P. and Liu, C. T., J. Mater. Res. 5, 754 (1990).Google Scholar
2. Rozner, A. G. and Wasilewski, R. J., J. Inst. Metals, 94, 169 (1966).Google Scholar
3. Hahn, K. H. and Vedula, K., Scripta Metall. 23, 7 (1989).Google Scholar
4. Schulson, E. M. and Barker, D. R., Scripta Metall. 17, 519 (1983).Google Scholar
5. Vedula, K. and Stephens, J. R., in MRS Symp. Proc., vol. 81, p. 381, Mater. Res. Soc., Pittsburgh, PA (1987).Google Scholar
6. Miracle, D. B., Russell, S., and Law, C. C., in MRS Symp. Proc., vol. 133, p. 225, Mater. Res. Soc., Pittsburgh, PA (1989).Google Scholar
7. Darolia, R., Lahrman, D. F., Field, R. D., and Freeman, A. J., p. 113 in Ref. 6.Google Scholar
8. Masahashi, N., Takasugi, T., and Izumi, O., Acta Metall. 36, 1815 (1988).Google Scholar
9. Liu, C. T., in MRS Symp. Proc., vol. 122, p. 429, Mater. Res. Soc., Pittsburgh, PA (1988).Google Scholar
10. Choudhury, A., White, C. L., and Brooks, C. R., Scripta Metall. 20, 1061 (1986).Google Scholar
11. McLean, D., Grain Boundaries in Metals (Clarendon Press, Oxford, 1957).Google Scholar
12. George, E. P., Liu, C. T., and Padgett, R. A., Scripta Metall. 23, 979 (1989).Google Scholar
13. King, A. H. and Yoo, M. H., p. 99 in Ref. 5.Google Scholar
14. Baker, I., Schulson, E. M., and Michael, J. R., Philos. Mag. B57, 379 (1988).Google Scholar
15. Schulson, E. M., Weihs, T. P., Viens, D. V., and Baker, I., Acta Metall. 33, 1587 (1985).Google Scholar
16. Khadkikar, P. S., Vedula, K., and Shale, B. S., Metall. Trans. 18A, 425 (1987).Google Scholar
17. Sieloff, D. D., Brenner, S. S., and Burke, M. G., p. 87 in Ref. 5.Google Scholar
18. Sieloff, D. D., Brenner, S. S., and Ming-Jian, Hua, p. 155 in Ref. 6.Google Scholar