Hostname: page-component-77c89778f8-gvh9x Total loading time: 0 Render date: 2024-07-19T23:22:19.000Z Has data issue: false hasContentIssue false

Measuring Diffusion Lengths in Epitaxial Silicon by Surface Photovoltage

Published online by Cambridge University Press:  15 February 2011

John Lowell
Affiliation:
Advanced Micro Devices, 5204 E. Ben White Blvd., Austin, TX 78741
Valerie Wenner
Affiliation:
Advanced Micro Devices, 5204 E. Ben White Blvd., Austin, TX 78741
Damon Debusk
Affiliation:
Advanced Micro Devices, 5204 E. Ben White Blvd., Austin, TX 78741
Get access

Abstract

In CMOS, the use of epitaxial layers for prevention of latch-up in logic technologies is well-known and pervasive. One of the crucial parameters is the amount of metallic contamination due to transition metals such as Fe in the epi since this phenomena effects both device performance and quality. However, the ability to measure this parameter on product material is not generally available due to inherent problems with most known methods. The limitation of traditional surface photovoltage is that the deep optical penetration of over a hundred microns is well-beyond the depth of most epitaxial layers and does not accurately profile the epitaxial region [1]. In this paper we report on the application of optical surface photovoltage (SPV) using a set of ultra-shallow optical filters to both quantify and qualify as-grown epitaxial layers on CZ P-type silicon. We believe that a non-contact, SPV measurement of Fe concentration and diffusion lengths within an epitaxial region has not been previously reported.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Lagowski, J., et.al., Semicond. Sci. Tech., 7, A185 (1992).Google Scholar
2. SPV Tools User's Manual (Semiconductor Diagnostics Inc., Tampa, FL, 1994), p. 26.Google Scholar
3. Falster, Robert, Diagnostic System for Metal Contamination in Wafer Manufacturing (Esprit Project, 1993).Google Scholar
4. Zoth, G., Tech. Proc. SEMICON Europa '90 (Zurich), p. 24 (1990)Google Scholar
5. Schroder, Dieter, Semiconductor Materials and Device Characterization, (Wiley, New York, 1990), p. 319.Google Scholar