Hostname: page-component-848d4c4894-wg55d Total loading time: 0 Render date: 2024-05-09T23:42:30.985Z Has data issue: false hasContentIssue false

Measurement of Stresses in Thin Films Using Holographic Interferometry: Dependence on Atmospheric Conditions

Published online by Cambridge University Press:  16 February 2011

Michele A. Maden
Affiliation:
Polymer Science and Engineering Department, University of Massachusetts, Amherst, MA 01003
Kun Tong
Affiliation:
Polymer Science and Engineering Department, University of Massachusetts, Amherst, MA 01003
Richard J. Farris
Affiliation:
Polymer Science and Engineering Department, University of Massachusetts, Amherst, MA 01003
Get access

Abstract

The direct measurement of stresses in spin-coated thin films is crucial for understanding their end use capabilities. A new technique for measuring the residual biaxial curing stresses in spin coated polymer films has been developed. This technique uses holographic interferometry to observe the modes of vibration of a membrane under biaxial tension. The stress in the film can then be determined by application of the vibrating membrane equation. A great advantage of this technique is that the material constants of the film do not enter into the analysis. The only material parameter needed is the density. In thispaper, we will examine membranes of polyimide and biaxially stretched rubber and latex. It is possible, using this technique to resolve the principal stresses and directions in films with complicated stress states.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Timoshenko, S., Vibration Problems in Engineering, Ch. 5, p 422,Van Nostrand-Rhinehold, Co., NY (1955)Google Scholar
2. Butkov, E., Mathematical Physics, Ch.9, p. 368 (1968).Google Scholar
3. Rayleigh, J.W.S., The Theory of Sound-I, pp. 306–351 (1945).Google Scholar
4. Maden, M.A. and Farris, R.J. Electronic Packaging Materials Science IV, Materials Research Soc. Proceedings, (1989).Google Scholar
5. Leith, E.N. and Upatnieks, J., Scientific American, 212(6),24 (1965).Google Scholar
6. Powell, R.L. and Stetson, K.A., J. Opt. Soc. Am., 55(12),1593 (1965).Google Scholar
7. Heflinger, L.O., Wuerker, R.F.,and Brooks, R.E., J. AppL Phys.,37(2), 642 1966).Google Scholar
8. Pennington, , Keith, S., Scientific American, 219(2), 40, (1968).Google Scholar
9. Taylor, , Charles, E., Experimental Mechanics, 19(9), 339 (1979).Google Scholar
10. Maissel, , Leon, I., and Glang, , Reinhard, , eds., Handbook of Thin Film Technology, Ch. 12, pp 12.312.50, McGraw-Hill Book Co., NY,(1970).Google Scholar
11. Jagota, A.. and Mazur, S., Thin Films: Stresses and Mechanical Properties II, Materials Research Soc. Proceedings, (1990).Google Scholar
12. Lax, , Melvin, , J. Acoust. Soc. Am., 16(1), 5 (1944).Google Scholar
13. Gottlieb, H.P.W.,and Aebischer, H.A., Acustica, 61(4), 223 (1986).Google Scholar
14. Geldermans, P., et al., Polyimides: Synthesis, Characterization and Applications, Vol.2, Mittal, K.L., ed., pp 695711, Plenum Press, NY (1984).Google Scholar