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Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints

Published online by Cambridge University Press:  26 February 2011

Su-Chun Yang ,
Cheng-En Ho ,
Chien-Wei Chang  and
C Robert Kao
Su-Chun Yang
Affiliation:
93324008@cc.ncu.edu.tw, National Taiwan University, Department of Materials Science and Engineering, No. 1, Sec. 4, Roosevelt Road,, Taipei, 10617, Taiwan
Cheng-En Ho
Affiliation:
ceho1975@hotmail.com, National Central University, Department of Chemical and Materials Engineering, No.300, Jhongda Rd.,, Jhongli City, 32001, Taiwan
Chien-Wei Chang
Affiliation:
s13242019@cc.ncu.edu.tw, National Central University, Department of Chemical and Materials Engineering, No.300, Jhongda Rd.,, Jhongli City, 32001, Taiwan
C Robert Kao
Affiliation:
kaocr@hotmail.com, National Taiwan University, Department of Materials Science and Engineering, No. 1, Sec. 4, Roosevelt Road,, Taipei, 10617, Taiwan
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Abstract

Spalling of intermetallic compounds in a massive scale has been reported in the literature for several solder/substrate systems, including SnAgCu soldered on Ni substrate, SnZn on Cu, high-Pb PbSn on Cu, and high-Pb PbSn on Ni. In this work, a common mechanism based on thermodynamic arguments is proposed to explain this rather peculiar phenomenon that occurs across several systems. According to this mechanism, two necessary conditions must be met. This first is that the most reactive element must be present in a limited amount, and the second is that the soldering reaction must be very sensitive to the concentration of this element. With the growth of intermetallic, more and more of the most reactive elements are extracted out of the solder and incorporated into intermetallic. As the concentration of this element decreases, the local equilibrium phase at the interface changes. This changing of the equilibrium phases caused the non-equilibrium phase to spall.

Keywords

solderingdiffusionsurface reaction
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V03-01
Copyright
Copyright © Materials Research Society 2007

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References

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