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Low Temperature Deposited Highly-Conductive N-type SiC Thin Films

Published online by Cambridge University Press:  10 February 2011

Kuan-Lun Cheng
Affiliation:
Dept. of Electronics Eng., National Chiao-Tung University, Hsinchu, Taiwan, ROC.
Huang-Chung Cheng
Affiliation:
Dept. of Electronics Eng., National Chiao-Tung University, Hsinchu, Taiwan, ROC.
Wen-Horng Lee
Affiliation:
Dept. of Chemical Eng., National Taiwan Institute of Technology, Taipei, Taiwan, ROC.
Chiapyng Lee
Affiliation:
Dept. of Chemical Eng., National Taiwan Institute of Technology, Taipei, Taiwan, ROC.
Tri-Rung Yew
Affiliation:
United Microelectronics Co., ATD-3, Science-based Park, Hsinchu, Taiwan, ROC.
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Abstract

Low-temperature deposited highly-conductive SiC films has long been a goal for many researchers involved in hetero-junction bipolar transistor, thin-film transistor, solar cell.… etc. Here in this paper, we study the influences of the diluted PH3 flow rates on SiC film quality as well as electrical properties. PH+ was determined from residual gas analyzer to be the main dopant source. Phosphorous atoms will play a role of enhancing the SiC grain growth and resulting in a smaller film growth rate. Carrier concentrations increase monotonically with the diluted PH3 flow rates. While Hall mobility first increases than decreases with it due to a combination effect of the impurity scattering and a film quality improvement which dominates when the 1% PH3/H2 flow rate is above or below 40 seem, respectively.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Morkoc, H., Strite, S., Gao, G. B., Lin, M. E., Sverdlov, B., and Burns, M., J. Appl. Phys. 76, p. 1363(1994).Google Scholar
2. Futagi, T., Matsumoto, T., Katsimo, M., Onta, T., Mimura, H. and Kitamura, K., Jpn. J. Appl. Phys. 31, L616 (1992).Google Scholar
3. Sugi, T., Yamazaki, T. and Ito, T., IEEE Trans. Electron Devices 37, p. 2331 (1990).Google Scholar
4. Itoh, M., Hori, M., Romano, M. and Mori, I., J. Vac. Sci. & Technol. B 9, p. 3262 (1991).Google Scholar
5. Cheng, K. L., Cheng, H. C., Liu, C. T., Lee, C. and Yew, T. R., Jpn. J. Appl. Phys. 34, p. 5527(1995).Google Scholar
6. Liu, C. C., Lee, C., Cheng, K. L. and Cheng, H. C. and Yew, T. R., Appl. Phys. Lett. 66, p. 168(1995).Google Scholar
7. Demichelis, F., Pirri, C. F. and Tresso, E., J. Appl. Phys. 72, p. 1327 (1992).Google Scholar
8. Sze, S. M., Physics of Semiconductor Devices. 2nd edition, John Weily & Sons, New York, 1981 pp. 463.Google Scholar