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Laser-Induced Microstructural Modification of Polycrystalline Cu and Ag Films Encapsulated in SiO2

Published online by Cambridge University Press:  01 February 2011

Rong Zhong ,
Jorg M.K. Wiezorek  and
John P. Leonard
Rong Zhong
Affiliation:
roz3@pitt.edu, University of Pittsburgh, Mechanical Engineering and Materials Science, Pittsburgh PA 15261, United States
Jorg M.K. Wiezorek
Affiliation:
wiezorek@pitt.edu, University of Pittsburgh, Mechanical Engineering and Materials Science, Pittsburgh, PA, 15261, United States
John P. Leonard
Affiliation:
jleonard@engr.pitt.edu, University of Pittsburgh, Mechanical Engineering and Materials Science, Pittsburgh, PA, 15261, United States
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Abstract

Excimer-laser-induced rapid lateral solidification was used to produce large grain microstructures in copper and silver thin films. These were multilayer thin film structures consisting of sputter deposited copper and silver thin films encapsulated by silica (SiO2/metal/SiO2/Si substrate). In this process, a single excimer laser pulse and projection imaging optics were used to melt a 60 micron wide line in the metal film. The resolidification of the melted lines is found to occur laterally in the plane of the film, resulting in grains greater than 20 um in length and 1 um wide. Electron diffraction analysis allowed identification of a strong <001> texture in the growth direction along the major axis of the elongated grains as well as similar texture parallel to the film surface. Various dislocation and faulted defect structures are identified and examined in the context of the rapid solidification and potential application to interconnects.

Keywords

laserrapid solidificationCu
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 990: Symposium B – Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics , 2007 , 0990-B09-07
Copyright
Copyright © Materials Research Society 2007

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