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Large Area, Rubber Stamped Plastic Circuits for Electronic Paper

Published online by Cambridge University Press:  21 March 2011

John A. Rogers ,
Kirk Baldwin ,
Zhenan Bao ,
Ananth Dodabalapur ,
V.R. Raju ,
Jay Ewing  and
Karl Amundson
John A. Rogers
Affiliation:
Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974, U.S.A.
Kirk Baldwin
Affiliation:
Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974, U.S.A.
Zhenan Bao
Affiliation:
Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974, U.S.A.
Ananth Dodabalapur
Affiliation:
Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974, U.S.A.
V.R. Raju
Affiliation:
Bell Laboratories, Lucent Technologies, Murray Hill, NJ 07974, U.S.A.
Jay Ewing
Affiliation:
E Ink Corporation, Cambridge, MA 02138, U.S.A.
Karl Amundson
Affiliation:
E Ink Corporation, Cambridge, MA 02138, U.S.A.
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Abstract

This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (∼1 [.mu]m) of the printed elements, the large area coverage (∼1 sq. ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 660: Symposia JJ – Organic Electronic & Photonic Materials and Devices , 2000 , JJ7.1
Copyright
Copyright © Materials Research Society 2001

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References

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