Hostname: page-component-5c6d5d7d68-tdptf Total loading time: 0 Render date: 2024-08-08T05:05:49.523Z Has data issue: false hasContentIssue false

Internal Strains and Relaxations in Lamellar TiAl

Published online by Cambridge University Press:  15 February 2011

P.M. Hazzledine
Affiliation:
UES Inc., 4401 Dayton-Xenia Road, Dayton OH 45432.
B.K. Kad
Affiliation:
Department AMES, University of California-San Diego, La Jolla, CA 92093
M.G. Mendiratta
Affiliation:
UES Inc., 4401 Dayton-Xenia Road, Dayton OH 45432.
Get access

Abstract

In the lamellar form of the ordered intermetallic TiAl, mismatches at the lamellar interfaces, of order 1%, give rise to internal stresses and lo interracial dislocations. The geometry of the microstructure ensures extreme plastic anisotropy. Three main trends are evident in the plastic tensile properties: Both the yield and fracture stresses are low when deformation occurs in the plane of the lamellae and they are high when deformation occurs across the lamellae, the ductility is high when the tensile axis lies close to the lamellar plane and low when the tensile axis is nearly normal to the lamellar plane. The variations of the yield stress and the fracture stress are explained principally by the effects of Schmid factors and anisotropies in the Hall-Petch (or Stroh) stresses resulting from the lamellar shapes. The variation in ductility may be understood in terms of a competition between the ductile propagation of dislocations across interfaces and the creation of Stroh cracks at the heads of dislocation pile-ups.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Frank, F.C. and van der Merwe, J.H., Proc. Roy. Soc. A198, 216 (1949)Google Scholar
2 Matthews, J.W., Philos. Mag. 29, 797(1974)Google Scholar
3 Inui, H., Oh, M.H., Nakamura, A. and Yamaguchi, M., Acta Mctall. et Mater.,40, 3095 (1992)Google Scholar
4 Yamaguchi, M. and Umakoshi, Y., Prog. Mater. Sci., 34, 1 (1990)Google Scholar
5 Hazzledine, P.M., Kad, B.K., Fraser, H.L. and Dimiduk, D.M., MRS Symposium 273,81 (1992)Google Scholar
6 Kad, B.K. and HazzIedine, P.M., Philos. Mag. Letters, 66,133 (1992)Google Scholar
7 WilliS, J.R., Jain, S.C. and Bullough, R., Philos. Mag. A62,115 (1990)Google Scholar
8 Kad, B.K., Hazzledine, P.M. and Fraser, H.L., MRS Symposium 288, 495 (1993)Google Scholar
9 Rao, S. and Woodward, C., Private Communication (1993)Google Scholar
10 Stroh, A.N., Proc. Roy. Soc., A223,404 (1954)Google Scholar
11 Nakano, T., Yokoyama, A. and Umakoshi, Y., Scripta Metall. et Mater., 27,1253 (1992)Google Scholar
12 Kad, B.K., Hazzledine, P.M. and Oliver, B., Microstructural Science 18,201 (1990)Google Scholar
13 Couret, A., Private Communication (1992)Google Scholar
14 Nakano, T. and Umakoshi, Y., I.S.I.J International 32, 1339(1992).Google Scholar