Hostname: page-component-848d4c4894-v5vhk Total loading time: 0 Render date: 2024-06-30T20:16:48.425Z Has data issue: false hasContentIssue false
  • English
  • Français

Interfacial Fluid Pressure and Its Effects on SiO2 Chemical Mechanical Polishing

Published online by Cambridge University Press:  14 March 2011

C. Zhou ,
L. Shan ,
J. R. Hight ,
S.H. Ng ,
A. J. Paszkowski ,
J. Tichy  and
S. Danyluk
C. Zhou
Affiliation:
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA30332
L. Shan
Affiliation:
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA30332
J. R. Hight
Affiliation:
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA30332
S.H. Ng
Affiliation:
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA30332
A. J. Paszkowski
Affiliation:
Chemical Products Corporation, Cartersville, GA
J. Tichy
Affiliation:
Mechanical and Aerospace Engineering Department, Rensselear Polytechnic Institute, Troy, NY
S. Danyluk
Affiliation:
School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA30332
Get access

Abstract

In this paper, the experimental results of interfacial fluid pressure and friction measurements during polishing are presented, as well as their dependence on some major process variables. Under simulated conditions, a sub-ambient fluid pressure was observed, and its magnitude was of the same order of magnitude as the applied polishing load. Since this fluid pressure is non-uniformly distributed, the contact stress, obtained by combining the effects of both applied load and the fluid pressure, is not uniform across the wafer and will result in non-uniform material removal. The mechanism of the presence of the fluid pressure was investigated, and an analytical model was developed to predict the magnitude and distribution of this fluid pressure. The effects of the sub-ambient fluid pressure on material removal rate and profile were tested with thermally grown silicon dioxide on 100mm diameter, P-type (100), single crystal silicon wafers. The polishing experiments show the effect of sub-ambient fluid pressure on polishing rate and profile.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 613: Symposium E – Chemical-Mechanical Polishing 2000 - Fundamentals… , 2000 , E7.1.1
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Pramanik, D., Weling, M. and Lin, X.W., 1998, “CMP Applications for Sub-0.25µm Process Technologies”, Proceedings of the Second International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing, v98–7, pp 1–8.Google Scholar
[2] The International Technology Roadmap for Semiconductors: 1998 updateGoogle Scholar
[3] Stine, B. E., Vallishayee, R., “On the impact of dishing in metal CMP processes on circuit performance”, Int Workshop Stat Metrol Proc IWSM 1998 IEEE Piscataway NJ USA, p64–67 Google Scholar
[4] Shan, L., Levert, J., and Danyluk, S., 1999, “Interfacial Pressure Measurements in Chemical Mechanical Polishing Interface”, MRS Symposium Pro., v566, 187–195 10.1557/PROC-566-187Google Scholar
[5] Johnson, K. L., “Contact Mechanics”, Cambridge University Press, Cambridge, UK, 1985, p41 10.1017/CBO9781139171731Google Scholar
[6] Greenwood, J. A. and Williamson, J. B. P., 1966, “Contact of Nominally Flat Rough Surfaces”, Proc Roy Soc London, A295, p300–319.Google Scholar
[7] Hamrock, B. J., 1994, “Fundamentals of Fluid Film Lubrication”, McGraw-Hill, p141.Google Scholar
[8] Patir, N. and Cheng, H., 1978, “An Average Flow Model for Determining Effects of Three Dimensional Roughness on Partial Hydrodynamic Lubrication”, ASME Journal of Lubrication Technology, Vol. 100, No. 1, p12–17.10.1115/1.3453103Google Scholar
[9] Preston, F. W., “The Theory and Design of Plate Glass Polishing Machines”, Journal of the Society of Glass Technology, v11, 1927, p214 Google Scholar