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Interface Of Aluminum/Ceramic Power Substrates Manufactured By Casting-Bonding Process

Published online by Cambridge University Press:  10 February 2011

X. S. Ning
Affiliation:
Shiojiri Works, DOWA Mining Co., Ltd., 9637–3 Manaitabara, Kataoka, Shiojiri, Nagano 399–07, Japan
Y. Ogawa
Affiliation:
Central Research Lab., DOWA Mining Co., Ltd., 277–1 Tobuki-Cho, Hachioji, Tokyo 192, Japan
K. Suganuma
Affiliation:
ISIR, Osaka University, 8–1 Mihogaoka, Ibaraki, Osaka 567, Japan suganuma@sanken.osaka-u.ac.jp
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Abstract

New processes for manufacturing Al/ceramic power substrates have been developed. These processes use a casting-bonding method to bond Al plates to the both sides of ceramic plates. The Al plates formed on the substrates are then chemically etched to be a desired shape using the conventional technology, followed by plating nickel on them. The power substrates manufactured by the process have both a perfect interface and an excellent thermal stress tolerance. Hence, these processes are especially suitable for assembling high reliability power devices such as IGBT power modules.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

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