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Interaction of Metallic Impurities Adsorbed on Si Wafers in SC1 Solution
Published online by Cambridge University Press: 25 February 2011
Abstract
Changes in the surface concentration of Fe, Ni, Cu and Zn on Si wafers processed in a NH 4OH / H2O2 / H2O (SC1) solution was investigated. The adsorption of Fe or Zn on Si wafers was not affected by the other impurities in the SC1 solution. However, the adsorption of Ni or Cu on Si wafers was obstructed by Fe, and was not obstructed by Zn.
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- Copyright © Materials Research Society 1992
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