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Interaction between abrasive particles and film surfaces in low down force Cu CMP

Published online by Cambridge University Press:  15 March 2011

Yuchun Wang ,
Isaac Zomora ,
Joe Hawkins ,
Renjie Zhou ,
Fred Sun ,
Roy Martinez ,
Jian Zhang ,
Bin Lu  and
Shumin Wang
Yuchun Wang
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Isaac Zomora
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Joe Hawkins
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Renjie Zhou
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Fred Sun
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Roy Martinez
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Jian Zhang
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Bin Lu
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
Shumin Wang
Affiliation:
Cabot Microelectronics, 870 N. Commons Drive, Aurora, Illinois 60504
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Extract

A robust copper slurry should have high removal rate, efficient planarization, optimal over polishing window and fast clearing without corrosion. These requirements were addressed in the choice of abrasive particles, film formation for copper passivation, selectivity of copper to barrier, and interactions between particles and film surfaces. The performance results of low dishing erosion and surface finish are discussed with the proposed mechanism.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 816: Symposium K – Advances in Chemical-Mechanical Polishing , 2004 , K4.8
Copyright
Copyright © Materials Research Society 2004

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References

1. Kim, H., Kwon, P., Lee, S., Kim, H.H., Lee, S.I., Song, S.Y., and Nam, C.W., “Control of pattern specific corrosion during aluminum chemical mechanical polishing”, in Chemical Mechanical Polishing 2001-Advances and Future Challenges, edited by Babu, S. V., Cadien, K.C., Yaho, H., Mater. Res. Soc. Proc. Vol 671, M6.6.1.Google Scholar