Hostname: page-component-848d4c4894-nr4z6 Total loading time: 0 Render date: 2024-06-08T02:04:48.571Z Has data issue: false hasContentIssue false
  • English
  • Français

In-Situ Chronoamperometry for CMP Slurry Investigations

Published online by Cambridge University Press:  01 February 2011

Jian Zhang ,
Steven Grumbine ,
Phillip W. Carter  and
Thomas Werts
Jian Zhang
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Steven Grumbine
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Phillip W. Carter
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Thomas Werts
Affiliation:
Cabot Microelectronics 870 N. Commons Dr., Aurora, IL 60504USA
Get access

Abstract

A new application of the electrochemical method, in situ chronoamperometry, has been developed and used as a tool for CMP slurry characterization. The measured current response, i, resulting from a small applied potential is fit to an exponential equation, i = io + A1exp(-t/tD). The fitting parameters serve as a measure of surface reactivity (io), surface film robustness (A1), and the kinetics of film formation (tD). A description of the method and correlations to polishing performance are discussed in this paper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W7.3
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Borst, C.L., Smith, S.M., Eissa, M. in Advances in Chemical Mechanical Polishing, edited by Boning, D.S., Bartha, J.W., Philipossian, A., Shinn, G., Vos, I., (Mater. Res. Soc. Proc. 816, San Francisco, CA, 2004) pp.K1.1–K1.1.12.Google Scholar
2. Carter, Melvin K and Small, Robert, Journal of Electrochemical Society 151 (10), B563, (2004).Google Scholar
3. Aksu, S., Wang, L., and Koyle, F. M., Journal of Electrochemical Society 150 (11), G718, (2003).Google Scholar
4. Kuiry, S. C., Seal, S., Fei, W., Ramsdell, J., Desai, V. H., Li, Y., Babu, S. V., and Wood, B., Journal of Electrochemical Society 150 (1), C36, (2003).Google Scholar
5. Aksu, S. and Doyle, F. M., Journal of Electrochemical Society, 148, B51, (2001).Google Scholar
6. Bard, A.J. and Faulkner, L.R., Electrochemical Methods — Fundamentals and Applications, (John Wiley & Sons, 1980) pp.138–142.Google Scholar
7. Carpio, R. A., US patent 5846398, (1998).Google Scholar
8. Sakai, K., US patent 6769960, (2004).Google Scholar
9. Matsui, Y., Kodera, M., Miyashita, N., Yoda, T., Advanced Metallization Conference 2000, (Mater. Res. Soc. Proc. 816, San Diego, CA, 2000), pp241–246.Google Scholar