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IN-SITU Analysis Of The Microstructure of Thermally Treated Thin Copper Films

Published online by Cambridge University Press:  21 February 2011

J. Nucci ,
H. Neves ,
Y. Shacham ,
E. Eisenbraun ,
B. Zheng  and
A. Kaloyeros
J. Nucci
Affiliation:
Cornell University, Dept. of Materials Science and the National Nanofabrication Facility, Ithaca, New York
H. Neves
Affiliation:
Cornell University, School of E. E. and the National Nanofabrication Facility, Ithaca, New York
Y. Shacham
Affiliation:
Cornell University, School of E. E. and the National Nanofabrication Facility, Ithaca, New York
E. Eisenbraun
Affiliation:
SUNY Albany, Physics Dept., Albany, New York
B. Zheng
Affiliation:
SUNY Albany, Physics Dept., Albany, New York
A. Kaloyeros
Affiliation:
SUNY Albany, Physics Dept., Albany, New York
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Abstract

Copper thin films were deposited by sputtering, electron beam evaporation, and electroless plating onto nitride membranes for TEM analysis. The samples were heat treated in-situ from room temperature to 600 °C for structural and chemical analysis. The as-deposited and heat treated microstructures were investigated. Orientation changes with heat treatment and reactions among the sample layers were analyzed by electron diffraction. This work provides baseline information for a study of the thermal evolution of copper lines.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 377
Copyright
Copyright © Materials Research Society 1993

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