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In-Process Evaluation of Kinetic Energy of Sputter Depositing Atoms Using Multijunction Thermal Converters

Published online by Cambridge University Press:  21 February 2011

Quanmin Su ,
D. X. Huang  and
Manfred Wuttig
Quanmin Su
Affiliation:
Department of Materials and Nuclear Engineering, University of Maryland, 20742-2115, USA
D. X. Huang
Affiliation:
Ballantine Labs. Inc., Cedar Knolls, NJ 07927,
Manfred Wuttig
Affiliation:
Department of Materials and Nuclear Engineering, University of Maryland, 20742-2115, USA
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Abstract

The kinetic energy of Au atoms was evaluated during sputter deposition of Au films using a multijunction thermal convenor (MJTC). The elastic strain energy of the deposited film was simultaneously measured by a high resolution vibrating membrane technique. For the evaluation the flux of Au atoms was treated as an energy flux irradiating a membrane connected to an infinite heat sink. The steady state temperature rise of this membrane under irradiation was used to convert to the kinetic energy of the atomic flux of known deposition rate. The kinetic energy of the sputter depositing Au flux was determined to be in the range of 5 to 18 eV. Only a fraction of it, of the order of 10−4, is converted into mechanical energy manifesting itself as film stress. The results demonstrate the possibility of using MJTCs as kinetic energy monitors during thin film deposition.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 356: Symposium B2 – Thin Films: Stresses and Mechanical Properties V , 1994 , 555
Copyright
Copyright © Materials Research Society 1995

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