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Influence of Specimen Size and Sub-Micron Notch on The Fracture Behavior of Single Crystal Silicon Microelements and Nanoscopic Afm Damage Evaluation

Published online by Cambridge University Press:  10 February 2011

Kohji Minoshima ,
Shigemichi Inoue ,
Tomota Terada  and
Kenjiro Komai
Kohji Minoshima
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
Shigemichi Inoue
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
Tomota Terada
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
Kenjiro Komai
Affiliation:
Department of Mechanical Engineering, Graduate School of Engineering, Kyoto University Yoshida-Honmachi, Sakyo-Ku, Kyoto 606-8501, Japan
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Abstract

Simple bending tests of single-crystal silicon microelements fabricated by photoetching were performed. Silicon microelements deform elastically until final catastrophic failure, showing a brittle nature. The fracture strength increases with a decrease in specimen size, and the maximum strength reaches about 8 GPa. A Focused ion beam was used to machine a sub-µm deep notch. Such a small notch decreases the fracture strength of a microelement. Some fatigue tests were conducted in laboratory air and in distilled water: water reduces the strength of microelement under fatigue loading. Fracture surface and sample surface were closely examined with a scanning electron microscope and an atomic force microscope, and the fracture mechanisms are discussed from the nanoscopic points of view.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 546: Symposium AA – Materials Science of Microelectromechanical Systems (MEMS)… , 1998 , 15
Copyright
Copyright © Materials Research Society 1999

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References

1. Johansson, S., Schweitz, J.-A., J. Appl. Phys., 63, 4799 (1988).Google Scholar
2. Greek, S., Ericson, F., Johansson, S., Schweitz, J.-Å, Thin Solid Films, 292, 430 (1997).Google Scholar
3. Mazza, E., Dual, J., Schiltges, G., Material Prüfung, 38, 430 (1996).Google Scholar
4. Tsuchiya, T., Tabata, O., Sakata, J., Taga, Y., Trans. IEE Japan, 116-E, 441 (1996).Google Scholar
5. Ogawa, H., Suzuki, K., Kaneko, S., Nakano, Y., Ishikawa, Y., Kitahara, T., Proc. IEEE Micro Electro Mechanical Systems ‘97, 430 (1997).Google Scholar
6. Hoffman, R.W. Jr., Mitchell, T.E., Hoffman, R.W., Thin Solid Films, 154, 149 (1987).Google Scholar
7. Connally, J.A., Brown, S.B., Experimental Mechanics, 81 (1993).Google Scholar
8. Read, D.T., Dally, J.M., Trans. ASME, J. Electronic Packaging, 117, 430 (1995).Google Scholar
9. Komai, K., Minoshima, K., Tawara, H., Inoue, S., Sunako, K., Trans. Japan Soc. Mech. Eng., 60A, 52 (1994).Google Scholar
10. Minoshima, K., Komai, K., Mater. Sci. Res. Int'l., 2, 209 (1996).Google Scholar
11. Komai, K., Minoshima, K., Inoue, S. and Fujii, H., Trans. Japan Soc. Mech. Engg., 62A, 978 (1996).Google Scholar
12. Wong, B., Holbrook, R.J., J. Electrochem. Soc., 134, 430 (1987).Google Scholar
13. Connally, J.A., Brown, S.B., Science, 256, 430 (1992).Google Scholar