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Influence of BHF Treatments on Hydrogen-Terminated Si(100) Surfaces

Published online by Cambridge University Press:  10 February 2011

T. Osada
Affiliation:
Morita Chemical Industries Co., Ltd. 3-12-10 Higashimikuni, Yodogawa-ku, Osaka 532, Japan
Y. Kawazawa
Affiliation:
Morita Chemical Industries Co., Ltd. 3-12-10 Higashimikuni, Yodogawa-ku, Osaka 532, Japan
S. Miyazaki
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 739, Japan
M. Hirose
Affiliation:
Department of Electrical Engineering, Hiroshima University, Higashi-Hiroshima 739, Japan
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Abstract

The hydrogen bonding features of Si(100) surfaces treated with BHF (NH4F/HF/H2O) have been studied by Fourier transform infrared attenuated total reflection spectroscopy (FT-IR-ATR). The amount of residual silicon-fluorine bonds on Si(100) surfaces has been evaluated by X-ray photoelectron spectroscopy (XPS). It is found that Si-H3 bonds appears to be preferentially removed by OH ions so as to increase the surface SiH2 and SiH bonds. On the other hand, it is likely that fluorine-containing ionic species such as HF2 might attack the backbonds of surface hydrides to produce Si-H3 and Si-F bonds. ATR spectra have shown that a BHF treated Si(100) surface in 5∼10% NH4F with molar ratios of HF/NH4F=0.37∼0.56 (pH=3.7∼4.0) at a treatment time of 5 minutes is atomically flatter than that treated in BHF containing 15∼20% NH4F. This is because the amount of residual Si-F bonds on Si(100) increases with HF2 concentration in BHF and these Si-F bonds enhance attacking of silicon backbonds of Si-F bond by OH and HF2 ions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

[1] Higashi, G. S., Chabal, Y. J., Trucks, G. W., and Raghavachari, K., Appl. Phys. Lett. 56, 656 (1990).CrossRefGoogle Scholar
[2] Sawara, K., Yasaka, T., Miyazaki, S., and Hirose, M., Jpn. J. Appl. Phys. 31, 931 (1992).CrossRefGoogle Scholar
[3] Hirose, M., Hiroshima, M., Yasaka, T., Takakura, M., and Miyazaki, S., Microelectronic Engineering 22, 3 (1993).CrossRefGoogle Scholar
[4] Morita, Y. and Tokumoto, H., Appl. Phys. Lett. 67, 2654 (1995).CrossRefGoogle Scholar
[5] Bender, H., Verhaverbeke, S., and Heyns, M. M., J. Electrochem. Soc. 141, 3128 (1994).CrossRefGoogle Scholar
[6] Bjorkman, C. H., Fukuda, M., Yamazaki, T., Miyazaki, S., and Hirose, M., Jpn. J. Appl. Phys. 34, 722 (1995).Google Scholar
[7] Ljungberg, K., Bäcklund, Y., Söderbärg, A., Bergh, M., Andersson, M. O., and Bengtsson, S., J. Electrochem. Soc. 142, 1297 (1995).CrossRefGoogle Scholar
[8] Verhaverbeke, S., Berlamont, J., De Keersmaecker, R. F., Declerck, G., Sansen, W., Vinckier, C., Hirose, M., Van Overstraeten, R., Heyns, M. M., in Dielectric Breakdown in Thermally Grown Oxide Layers. (1993), pp. 125–199.Google Scholar
[9] Chabal, Y. J., in Surface Science Reports 8, (North-Holland Physics Publishing Division, Amsterdam, 1988), pp. 211357.Google Scholar
[10] Mesmer, R. E. and Baes, C. F. Jr, lnorg. Chem. 8, 618 (1969).CrossRefGoogle Scholar