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In Situ Observations of Voiding in Metal Lines Under Passivation

Published online by Cambridge University Press:  22 February 2011

T. Marieb ,
J.C. Bravman ,
P. Flinn  and
M. Madden
T. Marieb
Affiliation:
Stanford University, Department of Materials Science and Engineering, Stanford, CA 94305-2205 Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95052-8119
J.C. Bravman
Affiliation:
Stanford University, Department of Materials Science and Engineering, Stanford, CA 94305-2205
P. Flinn
Affiliation:
Stanford University, Department of Materials Science and Engineering, Stanford, CA 94305-2205 Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95052-8119
M. Madden
Affiliation:
Intel Corporation, 3065 Bowers Ave., Santa Clara, CA 95052-8119
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Abstract

Movies showing high voltage scanning electron microscope (HVSEM) in situ observations of void motion in passivated metal lines were produced. By taking pictures of the line when the void morphology changes and combining these images digitally with a technique called morphing, a time-lapse movie is constructed with the minimum amount of stored images. The sequence of still images from which a movie is constructed are shown in this paper. This sequence demonstrates that wedge voids do not cause failure in near-bamboo pure Al lines; rather the void will move until it encounters a grain which it can grow across in a slit-like manner.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 409
Copyright
Copyright © Materials Research Society 1994

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References

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