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Improving the Quality of a Heteroepitaxial CaF2 Overlayer by Rapid Post Annealing

Published online by Cambridge University Press:  25 February 2011

Loren Pfeiffer
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
Julia M. Phillips
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
T.P. Smith III
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
W. M. Augustyniak
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
K. W. West
Affiliation:
AT&T Bell Laboratories, Murray Hill, NJ 07974
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Abstract

We show that post anneals of short duration at high temperature can markedly improve the quality of CaF2 films grown by molecular beam epitaxy (MBE) on Si (100). Anneals at 1100°C for 20 sec in an Ar ambient improved χmin, the ratio of backscattered 1.8 MeV He4 ions in the aligned to random direction, from as-grown values of .07 to .26, to post post-anneal values of .03 to .045. This is the best χmin yet reported for the CaF2:Si system. The post-annealed films also show improved resistance to chemical etching and mechanical stress, and increased dielectric breakdown voltages.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

REFERENCES

1 Phillips, J. M., Paper D3.1 of this conference. Symposium on Layered Structures, Epitaxy and Interfaces.Google Scholar
2 This idea is somewhat similar in spirit to some recent RTA-damage removal experiments. See Seidel, T. E., Lischner, D. J., Pai, C. S., Knoell, R. V., and Maher, D. M. in Nucl. Instr. and Meths. March (1985). In that work there are also two competing processes with different activation energies. The intention is to use RTA to remove crystal damage by promoting Si to Si epitaxy, without bringing up the sample temperature long enough to allow substantial redistribution of an As dopant.Google Scholar
3 The Model AG Heatpulse 210 is manufactured by AG Associates, Inc., Pal Alto, CA 94303.Google Scholar
4 People, R., Smith, T. P., III, Phillips, J. M. and Augustyniak, W. M., Paper D3.5 of this conference. Symposium on Layered Structures, Epitaxy and Interfaces.Google Scholar