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Impact of Mass and Lattice Difference on Thermal Boundary Conductance

Published online by Cambridge University Press:  27 July 2015

Changjin Choi
Affiliation:
Ph.D. Student, Mechanical Engineering, Utah State University, 4130 Old Main Hill, Logan, UT 84322, U.S.A.
Nick Roberts
Affiliation:
Assistant Professor, Mechanical Engineering, Utah State University, 4130 Old Main Hill, Logan, UT 84322, U.S.A.
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Abstract

The impact of mass and lattice difference on thermal boundary conductance is investigated using non-equilibrium molecular dynamics with the Lennard-Jones interatomic potential. Results show that the maximum thermal boundary conductance is achieved when the mass and the lattice of two dissimilar materials are matched, although the composite thermal conductance is not necessarily a maximum. It is observed that the small difference in mass and potential well depth has as significant an impact as large differences, and that the frequency mismatch is an important factor that affects thermal boundary conductance. It is, also, found that inelastic scattering begins to play a role at the interface as the temperature increases.

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Articles
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

U.S. Energy Information Administration, “Monthly energy review,” Tech. rep., Office of Energy Statistics, U.S. Department of Energy, March 2014.Google Scholar
Dresselhaus, M. S., Chen, G., Tang, M. Y., Yang, R., Lee, H., Wang, D., Ren, Z., Fleurial, J.-P., and Gogna, P., “New Directions for Low-Dimensional Thermoelectric Materials,” Advanced Materials, Vol. 19, 2007, pp. 10431053.CrossRefGoogle Scholar
Wang, X., Lee, H., Lan, Y., Zhu, G., Joshi, G., Wang, D., Yang, J., Muto, A., Tang, M., Klatsky, J., Song, S., Dresselhaus, M., Chen, G., and Ren, Z., “Enhanced thermo- electric figure of merit in nanostructured n-type silicon germanium bulk alloy,” Applied Physics Letters, Vol. 93, No. 193121, 2008.Google Scholar
Hochbaum, A., Chen, R., Delgado, R., Liang, W., Garnett, E., Najarian, M., Majumdar, A., and Yang, P., “Enhanced Thermoelectric Performance of Rough Silicon Nanowires,” Nature, Vol. 451, January 2008, pp. 163168.CrossRefGoogle Scholar
Lee, S. M., Cahill, D. G., and Venkatasubramanian, R., “Thermal Conductivity of Si-Ge Superlattices,” Applied Physics Letters, 1997.Google Scholar
Capinski, W. S., Maris, H. J., Ruf, T., Cardona, M., Ploog, K., and Katzer, D. S., “Thermal-conductivity measurements of GaAs/AlAs superlattices using a picosecond optical pump-and-probe technique,” Physical Review B, Vol. 59, March 1999, pp.1058113.CrossRefGoogle Scholar
Maiti, A., Mahan, G., and Pantelides, S., “Dynamical Simulations of Nonequilibrium Processes - - Heat Flow and the Kapitza Resistance across Grain Boundaries,” Solid State Communications, Vol. 102, No. 7, 1997, pp. 517521.CrossRefGoogle Scholar
Skye, A. and Schelling, P. K., “Thermal resistivity of Si-Ge alloys by molecular dynamics simulation,” Journal of Applied Physics, Vol. 103, No. 113524, 2008.CrossRefGoogle Scholar
Hu, M., Keblinski, P., and Schelling, P. K., “Kapitza conductance of silicon-amorphous polyethylene interfaces by molecular dynamics simulations,” Physical Review B, Vol. 79, No. 10, mar 2009, pp. 104305.CrossRefGoogle Scholar
Hu, L., Zhang, L., Hu, M., Wang, J.-S., Li, B., and Keblinski, P., “Phonon interference at self-assembled monolayer interfaces: Molecular dynamics simulations,” Physical Review B, Vol. 81, No. 23, june 2010, pp. 235427.CrossRefGoogle Scholar
Ong, Z.-Y. and Pop, E., “Molecular dynamics simulation of thermal boundary conductance between carbon nanotubes and SiO 2 ,” Physical Review B, Vol. 81, No. 15, apr 2010, pp. 155408 CrossRefGoogle Scholar
Luo, T. and Lloyd, J. R., “Enhancement of thermal energy transport across Graphene/Graphite and polymer interfaces: A moleculat dynamics study,” Advanced Functional Materials, Vol. 22, No. 12, 2012, pp. 24952502.CrossRefGoogle Scholar
Stevens, R. J., Norris, P. M., and Zhigilei, L. V., “Molecular dynamics study of thermal boundary conductance: Evidence of strong inelastic scattering transport channels,” International Mechanical Engineering Congress and Exposition, nov 2004.Google Scholar
Duda, J. C., English, T. S., Piekos, E. S., Soffa, W. A., Zhigilei, L. V., and Hopkins, P. E., “Implications of cross-species interactions on the temperature dependence of Kapitza conductance,” Physical Review B, Vol. 84, No. 19, nov 2011, pp. 193301.CrossRefGoogle Scholar
Lyver, IV, John, W., and Blaisten-Barojas, Estela. "Effects of the interface between two Lennard-Jones crystals on the lattice vibrations: a molecular dynamics study." Journal of Physics: Condensed Matter 21.34 (2009): 345402.Google Scholar
Chen, Y. F., Li, D. Y., Yang, J. K., Yu, Y. H., Lukes, J. R., and Majumdar, A., “Molecular dynamics study of the lattice thermal conductivity of Kr/Ar superlattice nanowires,” Physica B-Condensed Matter, Vol. 349, No. 14, June 2004, pp. 270280.CrossRefGoogle Scholar
Allen, M. and Tildesley, D., Computer Simulation of Liquids, Oxford, 1987.Google Scholar
Roberts, N. A. and Walker, D. G., “Phonon wave-packet simulations of Ar/Kr interface for thermal rectification,” Journal of Applied Physics, Vol. 108, No. 12, 2010, pp.123515.CrossRefGoogle Scholar
Roberts, N. A. and Walker, D. G., “Computational study of thermal rectification from nanostructured interfaces,” Journal of Heat Transfer, Vol. 133, No. 092401, 2011.CrossRefGoogle Scholar
Roberts, N. A. and Walker, D. G., “A review of thermal rectification observations and mechanisms in solid materials,” International Journal of Thermal Sciences, Vol. 50, No. 5, 2011, pp.648662.CrossRefGoogle Scholar