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High Temperature Ductility Minimum in Rapidly Solidified Ni3Al - B

Published online by Cambridge University Press:  21 February 2011

A. I. Taub
Affiliation:
General Electric Corporate Research and Development, PO Box 8, Schenectady, NY 12309
S. C. Huang
Affiliation:
General Electric Corporate Research and Development, PO Box 8, Schenectady, NY 12309
K. M. Chang
Affiliation:
General Electric Corporate Research and Development, PO Box 8, Schenectady, NY 12309
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Abstract

The elevated temperature mechanical properties of rapidly solidified, boron doped Ni3Al have been investigated. Melt spun ribbon, plasma deposits and HIP'ped powder were tested with the same general results. It was found that the boron doped, rapidly solidified alloy exhibits an increasing flow stress with increasing temperature similar to that reported for conventionally cast Ni3Al. In addition, the rapidly solidified alloys exhibited a severe ductility minimum in the range 500–750C. The ductility minimum is relatively insensitive to both boron and aluminum concentration, but the embrittlement onset temperature changes with processing and testing parameters. In all cases, the onset of the ductility drop coincides with the onset of the decrease of the flow stress. It is postulated that this behavior is due to a change in the flow mechanism at elevated temperature to one that is associated with grain boundary stress concentration.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

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