Hostname: page-component-8448b6f56d-wq2xx Total loading time: 0 Render date: 2024-04-23T12:35:33.428Z Has data issue: false hasContentIssue false

Formation of periodic grain boundary in an Si thin film crystallized by a linearly polarized Nd:YAG pulse laser with an ultra sonic oscillator

Published online by Cambridge University Press:  21 March 2011

Hirokazu Kaki
Affiliation:
JAIST (Japan Advanced Institute of Science and Technology), 1-1 Asahidai, Tatsunokuchi, Ishikawa 923-1292, Japan
Takehiko Ootani
Affiliation:
JAIST (Japan Advanced Institute of Science and Technology), 1-1 Asahidai, Tatsunokuchi, Ishikawa 923-1292, Japan
Susumu Horita
Affiliation:
JAIST (Japan Advanced Institute of Science and Technology), 1-1 Asahidai, Tatsunokuchi, Ishikawa 923-1292, Japan
Get access

Abstract

In order to obtain a large silicon (Si) grain and to control the location of its boundary in a Si film melting-crystallized by a pulse laser, we have proposed to use periodic thermal distribution spontaneously induced by irradiation of a linearly polarized laser beam. We estimated the suitable amorphous Si (a-Si) thickness taking account of multiple reflection theoretically and confirmed it experimentally. Also, we proposed a novel technique to reduce the irradiation pulse number to control the grain boundary location stably in the crystallized Si film, in which the elastic wave was generated on the surface of a-Si film prior to melting-crystallization by using an ultra sonic oscillator. Owing to this technique, we can control the grain boundary location periodically with only 1 pulse irradiation in the crystallized Si film.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Matsueda, Y., Inoue, S. and Shimoda, T., Digest of Tech. Papers AM-LCD'01 TS–3, 77 (2001).Google Scholar
2. Sameshima, T., Usui, S. and Sekiya, M., IEEE Electron Device Lett. 7, 276 (1986).Google Scholar
3. Sera, K., Okumura, F., Uchida, H., Itoh, S., Kaneko, S. and Hotta, K., IEEE Electron Device Lett. 36, 2868 (1989).Google Scholar
4. Ozawa, M., Oh, C. H. and Matsumura, M., Jpn. J. Appl. Phys. 38, 5700 (1999).Google Scholar
5. Hara, A. and Sasaki, N., Jpn. J. Appl. Phys. 39, L1 (2000).Google Scholar
6. Horita, S., Nakata, Y. and Shimoyama, A., Appl. Phys. Lett. 78, 2250 (2001).Google Scholar
7. Nakata, Y., Kaki, H. and Horita, S., Digest of Tech. Papers AM-LCD'01 TFT p1–6, 123 (2001).Google Scholar
8. Nakata, Y., Kaki, H. and Horita, S., Jpn, J. Appl. Phys. 43 (5A), (2004), in press.Google Scholar
9. Young, J. F., Sipe, J. E., Preston, J. S. and Driel, H. M. van, Appl. Phys. Lett. 41, 261 (1982).Google Scholar
10. Guosheng, Z., Fauchet, P. M. and Siegman, A. E., Phys. Rev. B 26, 5366 (1982).Google Scholar
11. Kaki, H., Ootani, T. and Horita, S., Digest of Tech. Papers AM-LCD'03 TFT p2–5, 137 (2003).Google Scholar