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Fabrication of Micro-Contact Probe Using Mo-Cr Spring with Au Plating Bump
Published online by Cambridge University Press: 01 February 2011
Abstract
In this paper, we report a new technology for fabricating interconnects and/or contact probes for LSI fabrication. We used a Mo-Cr spring wire as a lead wire. To reduce the resistance of the lead wire, we applied a Au plating bump to the tip of a Mo-Cr spring covered with Au thin film. Experimental results showed that contact resistance was lowered by forming an Au plating bump on the Mo-Cr spring wire, which was plated under controlled conditions.
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- Copyright © Materials Research Society 2004