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Evaluation of No-Clean Fluxes for High Reliability Applications

Published online by Cambridge University Press:  21 February 2011

E. Pope ,
J. Watson  and
D. Kennish
E. Pope
Affiliation:
Intel Corporation 5000 W. Chandler Blvd. Chandler AZ, 85226
J. Watson
Affiliation:
Intel Corporation 5000 W. Chandler Blvd. Chandler AZ, 85226
D. Kennish
Affiliation:
Intel Corporation 5000 W. Chandler Blvd. Chandler AZ, 85226
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Abstract

A series of rosin mildly activated, halide free, low residue fluxes have been evaluated for use with hot bar reflow of Tape Carrier Packages (TCP) to printed circuit boards (PCB). Materials were studied with respect to their wettability, SIR performance, water reflux extractable ionics and residue levels. Ionic levels were measured by FTIR and Ion chromatography. A flux was selected which has demonstrated acceptable performance in 156C/85%RH 10V biased stress testing.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 231
Copyright
Copyright © Materials Research Society 1995

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References

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