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Evaluation of Mechanical and Tribological Behavior, and Surface Characteristics of CMP Pads

Published online by Cambridge University Press:  18 March 2011

A. K. Sikder ,
I. M. Irfan ,
Ashok Kumar ,
A. Belyaev ,
S. Ostapenko ,
M. Calves ,
J. P. Harmon  and
J. M. Anthony
A. K. Sikder
Affiliation:
Center for Microelectronics Research, College of Engineering
I. M. Irfan
Affiliation:
Center for Microelectronics Research, College of Engineering
Ashok Kumar
Affiliation:
Center for Microelectronics Research, College of Engineering
A. Belyaev
Affiliation:
Center for Microelectronics Research, College of Engineering
S. Ostapenko
Affiliation:
Center for Microelectronics Research, College of Engineering
M. Calves
Affiliation:
Department of Chemistry University of South Florida 4202 East Fowler Avenue, Tampa, FL-33620
J. P. Harmon
Affiliation:
Department of Chemistry University of South Florida 4202 East Fowler Avenue, Tampa, FL-33620
J. M. Anthony
Affiliation:
Center for Microelectronics Research, College of Engineering
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Abstract

Chemical Mechanical Planarization (CMP) occurs at an atomic level at the slurry/wafer interface and hence slurries and polishing pads play a critical role in the successful implementation of this process. Surface roughness, visco-elastic properties, thickness and pore size also play an important role in this process. Unfortunately the mechanical properties of polyurethane polishing pads used in CMP are poorly understood. Here we have studied the mechanical and visco-elastic properties and surface morphology of CMP pads using nano-indentation and dynamic mechanical analysis along with high resolution scanning electron microscopy. A state-of-the-art Universal Micro-Tribometer was used to measure the pad deformation behavior under load. A novel non-destructive scanning ultrasonic transmission technique was also used to characterize inhomogeneity of the visco-elastic properties of full-size CMP pads. Results obtained by different techniques were analyzed to demonstrate methods for quick and reliable evaluation of pad quality for current CMP technology.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 671: Symposium M – Chemical-Mechanical Polishing 2001–Advances and Future Challenges , 2001 , M1.8
Copyright
Copyright © Materials Research Society 2001

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References

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