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Environmentally Stable, Low Dielectric Polymers from Soluble Intermediates

Published online by Cambridge University Press:  21 February 2011

T. Mates ,
C. K. Ober ,
B. Angelopolous  and
H. Martin
T. Mates
Affiliation:
Materials Science & Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
C. K. Ober
Affiliation:
Materials Science & Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
B. Angelopolous
Affiliation:
Materials Science & Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
H. Martin
Affiliation:
Materials Science & Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
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Abstract

We have investigated new polymers of poly(phenylene vinylene), PPV and poly(phenylene), PP. Like polyimides, these polymers can be spin-coated from soluble intermediates and converted to their thermally stable forms by elimination of small groups during a heating cycle. As such, these polymers are insulating. Both poly(phenylene vinylene) and poly(phenylene) also have the potential for metallic conductivity when properly doped. During curing, the complete removal of the leaving groups is important in determining the final behavior of the aromatized polymer film. Elimination of the leaving groups was followed by means of Rutherford Backscattering (RBS) and Forward Recoil Spectrometry (FRES) analysis for various curing conditions and environments. We will describe the curing and film-forming properties of these polymers, and discuss both their dielectric characteristics and thermal stability as a function of the curing conditions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 123
Copyright
Copyright © Materials Research Society 1990

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