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Electroplating of Gold-Tin Solder for Optoelectronic Applications

Published online by Cambridge University Press:  10 February 2011

Wenzhen Sun  and
Douglas G. Ivey
Wenzhen Sun
Affiliation:
Dept of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada
Douglas G. Ivey
Affiliation:
Dept of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada
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Abstract

Au-Sn eutectic solder is widely used in optoelectronic packaging. Electroplating of Au-Sn alloys is attracting increasing research interest because of its lower cost and potential to minimize voiding in bonding layers. The challenge in developing a non-cyanide Au-Sn electroplating bath lies in bath stability and deposit composition control. In this paper a relatively stable electroplating bath is developed based on a chloride solution using citrate as a buffering agent. Direct current plating and pulse current plating are performed and compared. The effects of Au and Sn concentrations in the bath, current density, and ON time on deposit composition and microstructures are also studied.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 153
Copyright
Copyright © Materials Research Society 1998

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References

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