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Electrochemical Behavior of Copper in Tetramethyl Ammonium Hydroxide Based Solutions

Published online by Cambridge University Press:  10 February 2011

W. H. Huang ,
S. Raghavan ,
Y. Fang  and
L. Zhang
W. H. Huang
Affiliation:
Dept of Material Science and Engineering, University of Arizona, Tucson, AZ
S. Raghavan
Affiliation:
Dept of Material Science and Engineering, University of Arizona, Tucson, AZ
Y. Fang
Affiliation:
Dept of Material Science and Engineering, University of Arizona, Tucson, AZ
L. Zhang
Affiliation:
Now with VLSI Technology, San Jose, CA
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Abstract

An investigation was undertaken to characterize the electrochemical behavior of copper in tetramethyl ammonium hydroxide (TMAH) based solutions. The effect of hydrogen peroxide and abrasion with a polyvinyl alcohol (PVA) brush on the corrosion of copper in alkaline solutions were characterized. Galvanic interactions between copper and tantalum in TMAH as well as in ammonium hydroxide (NH4OH) solutions were investigated. The experimental results have shown that the corrosion of copper in TMAH is lower than that in NH4OH, especially at pH values higher than 10. Even in the presence of hydrogen peroxide, TMAH corrodes copper at a lower rate than NH4OH.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 161
Copyright
Copyright © Materials Research Society 2000

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References

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