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Electrical Properties of n- and p-type In0.53Ga0.47As Layers Formed by Ion Implantation and Rapid Thermal(Flash)Anneal

Published online by Cambridge University Press:  28 February 2011

S.G. Liu
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
S.Y. Narayan
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
C.W. Magee
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
C.P. Wu
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
F. Kolondra
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
J. Paczkowski
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
D. Capewell
Affiliation:
David Sarnoff Research Center, Subsidary of SRI International, Princeton, NJ 08543–5300
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Abstract

Rapid thermal annealing (4−7s) of 28Si and 9Be implants in VPE-grown In0.53Ga0.47As has produced n- and p-type active layers with controlled doping levels between 1017 and 3×1018 cm−3. The multiple-implant schedules were based on Rp and ΔR data derived from SIMS measurements on single-energy implants. The activated n- and p-type layers have a good surface morphology and 300 K mobilities of 3000–7000 and 100–200 cm2 /V−s, respectively. Data on implant schedules, electrical characteristics, carrier concentration profiles, and Rp /ΔRp information are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1987

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References

REFERENCES

1. Kawata, H., Nishi, H., Bamba, Y., Sakurai, T., and Hashimoto, H., Jap. J. of Appl. Phys. 21, L431 (1982).Google Scholar
2. Slater, N.J., Choudhury, A.N.M.M., Tabatabaie-Alavi, K., Rowe, W., Fonstad, C.G., Alavi, K., and Cho, A.Y., Inst. Phys. Conf. Ser. No. 65, 627 (1982).Google Scholar
3. Favennec, P.N., L'Haridon, H., Gauneau, M., Salvi, M., Raquais, J.M., Razeghi, M., Inst. Phys. Conf. Ser. No. 79, 343 (1985).Google Scholar
4. Seo, K.S., Bhattacharya, P.K. and Dhar, S., Inst. Phys. Conf. Ser. No. 79, 337 (1985).Google Scholar
5. Selders, J., Wachs, H.J., Jurgensen, H., Elect. Lett. 22, 313 (1986).Google Scholar
6. Gardner, P.D., Liu, S.G., Narayan, S.Y., Colvin, S.D., Paczkowski, J.P., and Capewell, D.R., Elec. Device Lett., EDL-7, 363 (1986).Google Scholar
7. Upadhyayula, L.C., Gardner, P.D., Liu, S.G., and Narayan, S.Y., Elec. Device Lett. EDL-7, 390 (1986).Google Scholar
8. Liu, S.G. and Narayan, S.Y., J. of Electronic Materials, 13, 897 (1984).Google Scholar
9. Takeda, Y., Jap. J. of Appl. Phys. 23, 446 (1984).Google Scholar