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Effect of Varying Oxidation Parameters on the Generation of C-Dangling Bond Centers in Oxidized SiC

Published online by Cambridge University Press:  10 February 2011

P. J. Macfarlane
Affiliation:
Department of Physics, University of Alabama at Birmingham, 3 10 Campbell Hall, Birmingham, AL 35294–1170
M. E. Zvanut
Affiliation:
Department of Physics, University of Alabama at Birmingham, 3 10 Campbell Hall, Birmingham, AL 35294–1170
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Abstract

SiC is perhaps the most appropriate material to replace Si in power-metal-oxidesemiconductor- field-effect-transistors (MOSFETs), because, unlike the other wide band-gap semiconductors, SiC can be thermally oxidized similarly to Si to form a SiO2 insulating layer. In our studies of oxidized SiC, we have used electron paramagnetic resonance (EPR) to identify Cdangling bonds generated by hydrogen release from C-H bonds. While hydrogen's effect on SiCbased MOSFETs is uncertain, studies of Si-based MOSFETs indicate that it is important to minimize hydrogen in MOS structures. To examine the role of hydrogen, we have studied the effects of SiC/SiO2 fabrication on the density of C-related centers, which are made EPR active by a dry heat-treatment. Here we examine the starting and ending procedures of our oxidation routine. The parameter that appears to have the greatest effect on center density is the ending step of our oxidation procedure. For example, samples that were removed from the furnace in flowing O2 produced the smallest concentration of centers after dry heat-treatment. We report on the details of these experiments and use our results to suggest an oxidation procedure that limits center production.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

REFERENCES

[1] Macfarlane, P.J. and Zvanut, M.E., Appl. Phys. Lett. 71, 2148(1997).10.1063/1.119364Google Scholar
[2] Macfarlane, P.J. and Zvanut, M.E., in Hydrogen in Semiconductors and Metals, edited by N.H., Nickel, W.B., Jackson, R.C., Bowman, and R., Leisure (Mater. Res. Soc. 513, Pittsburgh, PA 1998), pp. 433438.Google Scholar
[3] Zhou, X., Watkins, G., Rutledge, K.M. McNamara, Messmer, R.P., and Chawla, S., Phys. Rev. B 54, 7881(1996).10.1103/PhysRevB.54.7881Google Scholar
[4] Gerardi, G., Poindexter, E., and Young, C., Appl. Spectrosc. 50 1427(1996).10.1366/0003702963904755Google Scholar
[5] Afanas'ev, V.V. and Stesmans, A., Appl. Phys. Lett. 69 2252(1996).10.1063/1.117144Google Scholar
[6] Macfarlane, P.J. and Zvanut, M.E., J. of Electron. Mater. 28, 144(1999).10.1007/s11664-999-0004-3Google Scholar
[7] Brower, K.L., Physical Review B42 3444 (1990).10.1103/PhysRevB.42.3444Google Scholar
[8] Stathis, J., J. Appl. Phys. 77 6205(1995).10.1063/1.359148Google Scholar
[9] Poindexter, E., J. Non-Crystalline Solids 187, 257(1995).10.1016/0022-3093(95)00146-8Google Scholar
[10] Lenahan, P.M. and Dressendorfer, P.V., J. Appl. Phys. 55, 3495(1984).10.1063/1.332937Google Scholar
[11] Lipkin, L.A. and Palmour, J.W., J. Electron. Mater. 25, 909(1996).10.1007/BF02666657Google Scholar
[12] Muehloff, L., Choyke, W.J., Bozack, M.J., and Yates, J.T., J. Appl. Phys. 60 2842(1986).10.1063/1.337068Google Scholar
[13] Shenoy, J.N., Chindalore, G.L., Melloch, M.R., Cooper, J.A., Palmour, J.W., and Irvine, K.G., J. Electron. Mater. 24, 303(1995).10.1007/BF02659691Google Scholar