Article contents
The Effect of Residual Stresses on the Rupture Properties of Film/Substrate Samples
Published online by Cambridge University Press: 22 February 2011
Abstract
The residual stresses of two different film/substrate systems were calculated. Besides, several micromechanical tests were performed. Joining the calculated residual stresses to the analysis of the experimental results, some insight on the interfacial adhesion of film/substrate systems is presented.
- Type
- Research Article
- Information
- Copyright
- Copyright © Materials Research Society 1989
References
- 4
- Cited by