Hostname: page-component-77c89778f8-swr86 Total loading time: 0 Render date: 2024-07-19T06:19:40.943Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of Particle Size Distribution on Filter Lifetime in Three Slurry Pump Systems

Published online by Cambridge University Press:  01 February 2011

Mark R. Litchy  and
Reto Schoeb
Mark R. Litchy
Affiliation:
CT Associates, Inc., 10777 Hampshire Avenue South Bloomington, MN 55438U.S.A.
Reto Schoeb
Affiliation:
Levitronix GmbH, Technoparkstrasse 1 CH-8005 Zurich, Switzerland
Get access

Abstract

Delivery systems are often used to supply the slurry used to planarize wafers during semiconductor chip manufacturing. These systems pressurize the slurry to deliver it to the tools and circulate it to help keep the particles in suspension. Pressurization and circulation are accomplished by various means including a variety of pumps and pressure-vacuum technology. Typically, slurry passes through a distribution system approximately 100 times before it is used to polish wafers[1].

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 867: Symposium W – Chemical-Mechanical Planarization-Integration, Technology and Reliability , 2005 , W2.8
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kvalheim, J., (personnel communication), BOC Edwards, Chanhassen, MN, March 2003.Google Scholar
2. Litchy, M. and Schoeb, R., Semiconductor International 27 (12), 87–90 (2004).Google Scholar
3. Lin, Z., Vasilopoulos, G., Devriendt, K., and Meuris, M., presented at SEMICON West 99 Technical Program, July, 1999.Google Scholar