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Effect of Mode-Mixity and Porosity on Interfacial Fracture of Low-k Dielectrics

Published online by Cambridge University Press:  17 March 2011

Caroline C. Merrill  and
Paul S. Ho
Caroline C. Merrill
Affiliation:
Intel Corporation 4100 Sara Road, F09-610, Rio Rancho, NM 87124, USA
Paul S. Ho
Affiliation:
Interconnect and Packaging Laboratory, The University of Texas at Austin10100 Burnet Road, PRC MRB 160, Austin, TX 78758, USA
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Abstract

In this study, we developed a system allowing interfacial adhesion measurements as a function of mode-mixity, from pure tension to pure shear. Results show that the debonding energy increases, by a factor of 3 to 10, as the amount of shear stress increases, approaching mode II conditions. For low k dielectrics, the debonding energy was found to decrease with increasing porosity and increase with increasing plasticity. The crack propagation is also dependent on mode-mixity.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F5.7
Copyright
Copyright © Materials Research Society 2004

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References

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