Hostname: page-component-848d4c4894-jbqgn Total loading time: 0 Render date: 2024-07-06T22:11:11.971Z Has data issue: false hasContentIssue false

Effect of Annealing on the Dielectric Properties and Microstructure of Tantalum Oxide T14in Films

Published online by Cambridge University Press:  15 February 2011

Chang Hwan Chun
Affiliation:
Add, Taejeon, Korea
Geun Hong Kim
Affiliation:
Add, Taejeon, Korea
Kyoung-Soo Yi
Affiliation:
Etri, Taejeon, Korea
Get access

Abstract

Effects of heat treatments on the dielectric properties of tantalum oxide thin films(250Å) deposited on the p-Si substrates by RF reactive sputtering were investigated. The leakage current density was considerably reduced from 10-9 to 10-12A/μm2 at an electric field of 2MV/cm after rapid thermal annealing in O2 at 1000°C, while little leakage reduction was observed after annealing at 500°C.

The structural changes of tantalum oxide thin film after annealing were examined using high resolution transmission electron microscopy. The leakage reduction after annealing can be attributed to crystallization and reoxidation of the amorphous tantalum oxide thin film.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Seki, S., Vnagami, T., Kogure, O., and Tsujiyama, B., J. Vac. Sci. Technol. A, 5, 1771 (1987)Google Scholar
2. Banerjee, S., Shen, B., Chen, I., Bohlman, J., Brown, G., and Doering, R., J. Appl. Phys., 65(3), 1140 (1989)Google Scholar
3. Saitoh, M., mori, T., and Tamura, H., Tech. Digest of ′86 IEDM, 680 (1986)Google Scholar
4. Shinriki, H., Nakata, M., Nishioka, Y. and Mukai, K., Digest of Symp. on VLSI Technology, 25∼26 (1989)Google Scholar
5. Isobe, C. and Saitoh, M., Appl. Phys. Lett., 56(10), 907∼909 (1990)Google Scholar
6. Benedict, J.P., Klepeis, S.J., Vandygrift, W.G., and Anderson, Ron, EMSA Bulletin 19:2 November, 74∼79 (1989)Google Scholar