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Donor Creation During Oxygen Implanted Buried Oxide Formation

Published online by Cambridge University Press:  28 February 2011

M. Delfino
Affiliation:
Philips Research Laboratories Sunnyvale, Signetics Corp., Sunnyvale, CA 94088
P.K. Chu
Affiliation:
Charles Evans and Associates, San Mateo, CA 94402
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Abstract

Enhanced electron conductivity is observed in silicon that has been implanted with oxygen ions to form a buried oxide layer. The conductivity is attributed to donors that are created in the silicon both above and below the oxide. Secondary ion mass spectrometry and Rutherford backscattering spectroscopy show that, during subsequent annealing, oxygen accumulates only in the silicon surface. This causes the donors in the silicon surface to be easily activated to high concentrations and, unlike donors beneath the oxide, to be extremely resistant to thermal annihilation.

Type
Research Article
Copyright
Copyright © Materials Research Society 1986

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References

REFERENCES

1.Hemment, P.L.F., p. 230, and Burnham, M.E. and Wilson, S.R., p. 240, in Advanced Applications of Ion Implantation, Current, M.I. and Sadana, D. K., Eds., Proc. SPIE, 530, (1985).Google Scholar
2.Coleman, M.G., “Method of Making Isolated Semiconductor Devices," U. S. Patent No. 3,707,765 (1973).Google Scholar
3.Eaton Corporation, the model NV-200 produces a 170 mA 160+ beam at an energy of 200 keV with a source lifetime in excess of 40 h.Google Scholar
4.Fuller, C.S., Dietzenberger, J.W., Hannay, N.B. and Buehler, E., Phys. Rev., 96, 833 (1954).Google Scholar
5.Fuller, C.S. and Logan, R.A., 3. Appl. Phys., 28, 1427 (1957).Google Scholar
6.Cristoloveanu, S., Wyncoll, J., Spinelli, P., Hemment, P.L.F., and Arrowsmith, R.P., Physica, 129B, 249 (1985).Google Scholar
7.Cristoloveanu, S., Pumfrey, J., Scheid, E., Hemment, P.L.F., Arrowsmith, R.P., Electronics Lett., 21, 804 (1985).Google Scholar
8.Spire Corporation, Bedford, MA 01730Google Scholar
9.Solecon Laboratories, Sunnyvale, CA 94089Google Scholar
10.Kanamori, A., Appl. Phys. Lett., 34, 287 (1979).Google Scholar
11.Jaussaud, C., Stoemenos, J., Margail, J., Dupuy, M., Blanchard, B. and Bruel, M., Appl. Phys. Lett., 46, 1064 (1985).Google Scholar