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Dielectric, Conducting, and Photonic Polymers for Devices in Multichip Packaging

Published online by Cambridge University Press:  21 February 2011

John F. Mcdonald ,
Nickolas P. Vlannes ,
Gary E. Wnek  and
Toh-Ming Lu
John F. Mcdonald
Affiliation:
Electrical, Computer, and Systems Engineering Department, Rensselaer Polytechnic Institute Troy, NY 12180-3590
Nickolas P. Vlannes
Affiliation:
Electrical, Computer, and Systems Engineering Department, Rensselaer Polytechnic Institute Troy, NY 12180-3590
Gary E. Wnek
Affiliation:
Chemistry Department, Rensselaer Polytechnic Institute Troy, NY 12180-3590
Toh-Ming Lu
Affiliation:
Physics Department, Rensselaer Polytechnic Institute Troy, NY 12180-3590
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Abstract

Polymeric materials have traditionally enjoyed widespread use in the electronics industry. Recent advances in the identification and synthesis of polymers with unusual electrical and optical properties have opened new opportunities for technological applications. Some of these novel properties are summarized in this paper with an emphasis on how these properties may be usefully exploited in the area of multichip packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 387
Copyright
Copyright © Materials Research Society 1989

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