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Development of Mechanical Stress in Cuni(mn) Films During Temperature Ramping: Related Mechanisms

Published online by Cambridge University Press:  10 February 2011

W. Brückner ,
St. Baunack ,
W. Pitschke  and
J. Thomas
W. Brückner
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01 171 Dresden, Germany, w.brueckner@jfw-dresden.de
St. Baunack
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01 171 Dresden, Germany, w.brueckner@jfw-dresden.de
W. Pitschke
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01 171 Dresden, Germany, w.brueckner@jfw-dresden.de
J. Thomas
Affiliation:
Institute of Solid State and Materials Research Dresden, D-01 171 Dresden, Germany, w.brueckner@jfw-dresden.de
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Abstract

This paper focusses on the development of biaxial stress in Cu0.57Nio. 42Mno.ol thin films during annealing in Ar and, for comparison, in vacuum. Besides stress-temperature measurements also resistance-temperature investigations as well as chemical and microstructural characterization by Auger electron spectroscopy, scanning and transmission electron microscopy, and X-ray diffraction were carried out. To explain the stress evolution, atomic rearrangement (excessvacancy annihilation, grain-boundary relaxation, and shrinkage of grain-boundary voids) and oxidation were considered. Up to 250 - 300 °C grain-boundary relaxation was found to be the dominating process. A sharp transition from compressive to tensile stress between 300 °C and 380 °C is explained by the formation of a NiO surface layer

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 505 , 1997 , 397
Copyright
Copyright © Materials Research Society 1998

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References

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