Hostname: page-component-5c6d5d7d68-wp2c8 Total loading time: 0 Render date: 2024-08-06T14:22:34.687Z Has data issue: false hasContentIssue false
  • English
  • Français

Development of a Composite Tape Conductor of Y-Ba-Cu-O

Published online by Cambridge University Press:  28 February 2011

R.D. Blaugher ,
D.W. Hazelton ,
J.A. Rice  and
M.S. Walker
R.D. Blaugher
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
D.W. Hazelton
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
J.A. Rice
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
M.S. Walker
Affiliation:
Intermagnetics General Corporation, Guilderland, NY 12084
Get access

Abstract

Samples of a prototype composite tape conductor have been prepared consisting of a thick layer of Y Ba2 Cu3 O7 (123) on a metallic substrate. A thick coating of 123 precursor powder was applied to the substrate by a mechanical compaction process. A melt-quench-growth technique was then employed to effect a textured grain development and improved current density. The resulting melt processed structure showed a textured 123 orthorhombic matrix with a dispersion of the 211 phase. The orthorhombic 123 phase was highly developed with an onset temperature of 90K and current density near 104 A/cm2 at 4T and 50K measured by a steady-state magnetization method.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 169: Symposium M – High Temperature Superconductors: Fundamental Properties and Novel Materials Processing , 1989 , 1205
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Nagato, M., Ohmata, K, Mukai, H., Hikata, T., Hosoda, Y., Shibuta, N., Sato, K., Hitosuyanagi, H., Kawashima, M., Materials for Cryogenic Technology Symposium, May 15–16,1989, Japan.Google Scholar
2 Jin, S., Trefel, T.H., Sherwood, R.C., Davis, M.E., VanDover, R.B., Kammloff, G.W., Fastnacht, R.A., Keith, H.D., Appl. Phys. Lett., 52, p. 2075, 1988.Google Scholar
3 Details on the metallic substrate will be published at a later date.Google Scholar
4 Murakami, M., Morita, M., Miyamoto, K., Matsuda, S., to be published in Proc. Osaka Univ. Int. Symp. on New Developments in Applied Superconductivity, Osaka, 1988.Google Scholar
5 Blaugher, R.D., Hazelton, D.W., Rice, J.A., to be published Proc. of the Conf. on Superconducting Materials and Applications, Buffalo, NY, Sept. 19–22, 1989.Google Scholar
6 Bean, C.P., Phys. Rev. Lett., 8, p. 250,1962.Google Scholar