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Crystalline Structure and Composition of Tin Oxide Film Grown by Reactive Ion Assisted Deposition as a Function of Average Diradiating Energy

Published online by Cambridge University Press:  21 February 2011

W.K. Choi
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
S.K. Song
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
J.S. Cho
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
H.-J. Jung
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
S.K. Koh
Affiliation:
Division of Ceramics, Korea Institute of Science and Technology, Cheongryang P.O. Box 131, Seoul, Korea
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Abstract

Tin oxide films with highly preferred orientation along <101 axis were grown on Si(100) substrate by using reactive ion assisted deposition method. The impinging average ion energy per depositing Sn atom was changed from 10 to 100 eV/atom. Oxygen content in the deposited tin oxide films increased as average impinging ion energy were raised. The maximum XRD peak intensity appeared when the average energy of about 50 eV/atom was applied. From quantitative Auger electron spectroscopy, characteristic transitional Auger peaks of Sn MNN were shifted to lower kinetic energies as much as 4 ∼ 6±1.0 eV as the Sn4+ component became dominant in the deposited tin oxide films. On the basis of a tin 3d core level spectra analysis by XPS, it was determined that a sizable chemical shift of 1.0±0.02 eV occurred between stannous tin(Sn2+:SnO) and stannic tin(Sn4+:SnO2). The optical transmittance was also measured in the wavelength range from 200 to 800 nm for tin oxide films deposited on BK7 glass substrate.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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