Hostname: page-component-76fb5796d-x4r87 Total loading time: 0 Render date: 2024-04-26T07:16:09.104Z Has data issue: false hasContentIssue false

Control of Threshold Voltage on the Excimer Laser Annealed Poly-Si Tfts by Oxygen Plasma Treatment on Poly-Si Surface

Published online by Cambridge University Press:  15 February 2011

Jae-Ik Woo
Affiliation:
LCD Research Lab., LG Electronics Inc., Anyang-Shi, Kyongki-Do, 430–080, Korea.
Sang-Gul Lee
Affiliation:
LCD Research Lab., LG Electronics Inc., Anyang-Shi, Kyongki-Do, 430–080, Korea.
Dae-Gyu Moon
Affiliation:
LCD Research Lab., LG Electronics Inc., Anyang-Shi, Kyongki-Do, 430–080, Korea.
Chan-Hee Hong
Affiliation:
LCD Research Lab., LG Electronics Inc., Anyang-Shi, Kyongki-Do, 430–080, Korea.
Hoe-Sup Soh
Affiliation:
LCD Research Lab., LG Electronics Inc., Anyang-Shi, Kyongki-Do, 430–080, Korea.
Get access

Abstract

Oxygen plasma treatment was performed on the excimer laser annealed poly-Si surface, followed by gate oxide deposition with low pressure chemical vapor deposition (LPCVD) in order to control the threshold voltage of excimer laser annealed poly-Si thin film transistors (TFTs).

Threshold voltages of n-channel TFTs increase from 0.4 to 2.8 V by varying the treatment time from 0 to 7 min. It is shown the effective charge density increased toward negative direction with increase of the treatment time.

In addition to the increase of threshold voltage, the oxygen plasma treatment on the Si surface led to an increase in the deposition rate of LPCVD oxide films with an apparent reduction of carbon around the interface between gate insulator and poly-Si film after oxygen plasma treatment.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Takabatake, M., Ohwada, J., Ono, Y. A., Mimura, A. and Konishi, N., IEEE Trans. Electron Devices ED-38, 1303, (1989).Google Scholar
2 Kuriyama, H., Kuwahara, T. and Ishida, S., Jpn. J. Appl. Phys., 31, 4550 (1992).Google Scholar
3 Maegawa, S., Maeda, S., Ipposhi, T., Nishimura, H., Ichiki, T. and Ashida, M., IEEE Trans. Electron Devices, 42, 1106 (1995).Google Scholar
4 Wright, P. J. and Saraswat, K. C., IEEE Trans. Electron Devices, ED-32, 1878 (1985).Google Scholar
5 Furuta, M., Kawamura, T., Yoshioka, T. and Miyata, Y., IEEE Trans. Electron Devices, 40, 1964 (1993)Google Scholar