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Composite Films of Copper / Boron Nitride and Nickel / Boron Nitride

Published online by Cambridge University Press:  10 February 2011

Maria Hepel ,
Tania Tannatoli ,
Christopher Baxter  and
Richard Stephenson
Maria Hepel
Affiliation:
Department of Chemistry, State University of New York, Potsdam, New York 13676
Tania Tannatoli
Affiliation:
Department of Chemistry, State University of New York, Potsdam, New York 13676
Christopher Baxter
Affiliation:
Department of Chemistry, State University of New York, Potsdam, New York 13676
Richard Stephenson
Affiliation:
Department of Chemistry, State University of New York, Potsdam, New York 13676
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Abstract

The formation and characterization of composite films of copper/boron nitride (Cu/BN) and nickel/boron nitride (Ni/BN) are described. Composite Cu/BN and Ni/BN films were synthesized by a metal electrodeposition from suspensions of boron nitride particles on carbon steel substrates. The effects of concentration of boron nitride in the solution, temperature, potential and various additives on the morphology of composite films have been investigated. The morphology of these films was examined using Scanning Electron Microscopy. The elemental analysis for boron, nitrogen, copper and nickel was performed using Energy Dispersive X-ray Spectroscopy (EDS), and a Microprobe X-ray Analyzer. The Vickers hardness of Cu/BN and Ni/BN films prepared under different conditions was also investigated. It has been found that the composite Cu/BN and Ni/BN films have an increased microhardness as compared to the respective pure metal films. The effects of deposition potential, temperature, concentration of BN and presence of various additives on the microhardness of Cu/BN and Ni/BN films have been investigated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 451: Symposium P – Electrochemical Synthesis and Modification , 1996 , 481
Copyright
Copyright © Materials Research Society 1997

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References

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