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Comparative Analysis of the Nucleation and Growth of Copper on Different Low-k Polymers

Published online by Cambridge University Press:  17 March 2011

V. Zaporojtchenko ,
J. Erichsen ,
T. Strunskus ,
K. Behnke ,
F. Faupel ,
M. Baklanov  and
K. Maex
V. Zaporojtchenko
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
J. Erichsen
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
T. Strunskus
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
K. Behnke
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
F. Faupel
Affiliation:
Lehrstuhl für Materialverbunde, Faculty of Engineering, University of Kiel, Kaiserstr. 2, 24143 Kiel, Germany
M. Baklanov
Affiliation:
2 IMEC, Leuven, Belgium
K. Maex
Affiliation:
2 IMEC, Leuven, Belgium
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Abstract

In this work we present investigations of the nucleation and growth of evaporated copper on several low-k polymers. The evolving interfaces were characterized using transmission electron microscopy (TEM), x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The results were compared between the PMDA/ODA polyimide, Teflon AF 1601 and Silk®. A diffusion coefficient for copper atoms in Silk® determined by low energy ion-beam depth profiling in conjunction with XPS is reported.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 714: Symposium – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics II , 2001 , L8.1.1
Copyright
Copyright © Materials Research Society 2001

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References

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