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Characterizing the Role of Deformation during Electrochemical Etching of Metallic Films

Published online by Cambridge University Press:  21 March 2011

Anil Kumar ,
Keng Hsu ,
Kyle Jacobs ,
Placid Ferreira  and
Nicholas X. Fang
Anil Kumar
Affiliation:
Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, University of Illinois at Urbana-Champaign, IL 61801 USA Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, IL 61801 USA
Keng Hsu
Affiliation:
Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, University of Illinois at Urbana-Champaign, IL 61801 USA Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, IL 61801 USA
Kyle Jacobs
Affiliation:
Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, University of Illinois at Urbana-Champaign, IL 61801 USA Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, IL 61801 USA
Placid Ferreira
Affiliation:
Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, University of Illinois at Urbana-Champaign, IL 61801 USA Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, IL 61801 USA
Nicholas X. Fang
Affiliation:
Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, University of Illinois at Urbana-Champaign, IL 61801 USA Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, IL 61801 USA Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139 USA
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Abstract

Electrochemical dissolution of ionic species into a solid is an area of great interest in several fields including nanoscale patterning and energy storage. Such dissolution is strongly influenced by several factors e.g., work function difference, dislocation density, grain size, and number of grain boundaries. These parameters are strongly influenced by mechanical deformation of the ionic conductor. Here we characterize such a system of silver (Ag) and silver sulfide (Ag2S), where incorporation of Ag into the solid ionic conductor, Ag2S, is dramatically influenced by mechanical deformation. We show more than three-fold dissolution rate enhancement when the polycrystalline conductor is compressed to one-third of its original size. We attribute this enhancement to increased dislocation density which is supported by the high current densities observed during dissolution. Additionally, reduced electronic currents suggest most of this contribution comes from increased reaction at the metal-conductor interface. Our studies have important applications in areas involving ionic transport including direct metal patterning and energy storage technology.

Keywords

defectsintercalationion-solid interactions
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1297: Symposium P – Deformation Mechanisms, Microstructure Evolution and Mechanical Properties of Nanoscale Materials , 2011 , mrsf10-1297-p10-60
Copyright
Copyright © Materials Research Society 2011

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References

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