Hostname: page-component-76fb5796d-25wd4 Total loading time: 0 Render date: 2024-04-26T04:55:16.837Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization of texture and microstructure of electrodeposited Ni layers

Published online by Cambridge University Press:  01 February 2011

Homuro Noda ,
Akinobu Shibata ,
Masato Sone ,
Chiemi Ishiyama  and
Yakichi Higo
Homuro Noda
Affiliation:
noda.h.ab@m.titech.ac.jp, Tokyo institute of technology, Department of Materials Science and Engineering, Yokohama, Japan
Akinobu Shibata
Affiliation:
shibata@pi.titech.ac.jp, Tokyo institute of technology, Precision and Intelligence Laboratory, Yokohama, Japan
Masato Sone
Affiliation:
sone.m.aa@m.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
Chiemi Ishiyama
Affiliation:
cishiyam@pi.titech.ac.jp, Tokyo Institute of Technology, Precision and Intelligence Laboratory, Yokohama, Japan
Yakichi Higo
Affiliation:
yhigo@pi.titech.ac.jp, Tokyo institute of technology, Precision and Intelligence Laboratory, Yokohama, Japan
Get access

Abstract

The texture and microstructure of electrodeposited Ni layers formed in an additive-free Watt's bath were investigated. The microstructure of the electrodeposited Ni layer consists of fine columnar grains extending along the growth direction. The major texture components of electrodeposited Ni layers on Ni-P substrate were (112) and (110) fibers. On the other hand, electrodeposited Ni layers on Cu substrate had a strong (110) fiber texture. In the vicinity of the interface between the electrodeposited Ni layer and the Cu substrate, obvious epitaxial regions were not observed. Many twins parallel to the growth direction were observed in the electrodeposited Ni layer. It is suggested that grains with a twin relationship grew preferentially during the electrodeposition reaction.

Keywords

electrodepositiontexturemicrostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1112: Symposium E – Materials and Technologies for 3-D Integration , 2008 , 1112-E05-01
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Weil, R., Annu. Rev. Mater. Sci. 19, 165 (1989).Google Scholar
2. Kato, M., Mater. Sci. Eng. A146, 205 (1991).Google Scholar
3. Amblard, J., Epelboin, I., Froment, M. and Maurin, G., J. Appl. Electrochem. 9, 233 (1979).Google Scholar
4. Kollia, C., Spyrellis, N., Amblard, J., Froment, M. and Maurin, G., J. Appl. Electrochem. 20, 1025 (1990).Google Scholar
5. Nielsen, C. B., Horsewell, A. and Ostergard, M. J. L., J. Appl. Electrochem. 27, 839 (1996).Google Scholar
6. Rasmussen, A. A., Jensen, J. A. D., Horsewell, A. and Somers, M. A. J., Electrochim. Acta. 47, 67 (2001).Google Scholar
7. Pantleon, K., Jensen, J. A. D. and Somers, M. A. J., J. Electrochem. Soc. 151, C45 (2004).Google Scholar
8. Bastos, A., Zaefferer, S., Rabbe, D. and Schuh, C., Acta Mater 54, 2451 (2006).Google Scholar
9. Cui, B. Z., Han, K., Xin, Y., Waryoba, D. R. and Mbaruku, A. L., Acta Mater 55, 4429 (2007).Google Scholar