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Characterization of Spin -on Glasses by Microindentation.

Published online by Cambridge University Press:  10 February 2011

Eva E. Simonyi
Affiliation:
IBM Research Yorktown Heights, Kamelesh Srivastava IBM E.Fishkill.
K.-W. Lee
Affiliation:
IBM Research Yorktown Heights, Kamelesh Srivastava IBM E.Fishkill.
Robert F. Cook
Affiliation:
IBM Research Yorktown Heights, Kamelesh Srivastava IBM E.Fishkill.
Eric G. Liniger
Affiliation:
IBM Research Yorktown Heights, Kamelesh Srivastava IBM E.Fishkill.
James Speidell
Affiliation:
IBM Research Yorktown Heights, Kamelesh Srivastava IBM E.Fishkill.
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Abstract

Spin-on glasses are candidates in the microelectronics industry as low dielectric constant insulating layers. Spin-on glasses are very brittle materials. This paper discusses measurement problems as relevant to the characterization of a brittle material by the indentation technique. As for all polymeric materials curing temperature is the most important preparation parameter. There is a correlation between hardness, Young's modulus, the onset of cracking with curing temperature. This dependence on curing temperature is also expressed by the change in Si-H bond density as shown by FTIR data. Life expectancy or aging characteristics were also investigated for these features. As an example results on silsesquioxane spin -on glasses are presented.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

1. Miller, R. D., Hedrick, J. L., Yoon, D.Y., Hawker, C., Carter, K., Cook, R. F., Liniger, E.G., Hummel, J.P. MRS Bull. 22, p. 44 (1997)Google Scholar
2. Oliver, W. C. and Pharr, G.M., J Mat. Res. 7, p. 1564 (1992)Google Scholar
3. Mencik, J. and Swain, M.V. Materials Forum, 18, p. 277 (1994)Google Scholar
4. Swain, M. W., Nat. Conf. Publication, 2, p. 549 (1993)Google Scholar
5. Liu, Chi-Wen Dai, Bau-Tong Yeh, Ching-Fa J. Electrochem. Soc. 142, p. 3098 (1995)Google Scholar