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Characterization of Polymer Dielectrics for High-Density Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

David W. Wang  and
Ho-Ming Tong
David W. Wang
Affiliation:
Systems Technology Division, IBM Corporation, 1701 North Street, Endicott, NY 13760
Ho-Ming Tong
Affiliation:
General Technology Division, IBM Corporation, Route 52 Hopewell Junction, NY 12533
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Abstract

Because of rapid advances in semiconductor technology, polymer dielectrics are finding widespread use in high-density packaging to improve performance and processability. Notable among these materials are polyimides, benzocyclobutene resins, and fluoropolymer containing composites.

Polyimides have been used extensively for chip passivation and first-level packaging. Benzocyclobutenes, processed as conventional thermosets, are being investigated as thin film dielectric for use in multichip modules. A silicon containing derivative can be used as a plasma etch stop. Polytetrafluoroethylene is used either as matrix or reinforcement in circuit boards to produce a low dielectric constant composite.

Knowledge of materials properties is crucial to ensure the reliability and function of products incorporating these polymers. In this article, a few selected characterization techniques for the determination of important materials properties such as solvent diffusion, plasma etch rate, and thermomechanical characteristics will be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 277
Copyright
Copyright © Materials Research Society 1991

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