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Characterization of Doped Si-TiSi2 Bilayers Formed by Ion Beam Mixing and Rapid Thermal Annealing

Published online by Cambridge University Press:  25 February 2011

K. Maex
Affiliation:
ESAT Laboratory, Katholieke Universiteit Leuven, Belgium
R.F. de Keersmaecker
Affiliation:
ESAT Laboratory, Katholieke Universiteit Leuven, Belgium
P.F.A. Alkemade
Affiliation:
State University Utrecht, The Netherlands
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Abstract

The use of rapid thermal processing is reported for simultaneous formation of TiSi2 from Ti deposited layers and activation of As or Sb implanted profiles in Si. Properties of the silicide and the doped Si are reported with emphasis on impurity redistribution and defect removal.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

REFERENCES

1. Maex, K., Keersmaecker, R.F. De, Alkemade, P.F.A., Habraken, F.H.P.M. and Weg, W.F. van der, Proc. MRS Europe Conference, June 1984, eds. Pinard, P. and Kalbitzer, S. (Les Editions de Physique) pp. 315322.Google Scholar
2. Nagasawa, E., Okabayashi, H. and Morimoto, M., Jap. J. Appl. Phys. 22 (1983) L57.Google Scholar
3. Berti, M., Drigo, A.V., Cohen, C., Siejka, J., Bentini, G.G., Nipoti, R. and Guerri, S., J. Appl. Phys. 55 (1984) 3558.Google Scholar
4. Knapp, J.A., PicrauK, S.T., Wu, C.S. and Lau, S.S., Appl. Phys. Lett. 44 (1984) 747.Google Scholar
5. Maydell-Ondrusz, E.A., Hemment, P.L.F., Stephens, K.G. and Moffat, S., El. Lett. 18 (1982) 752.Google Scholar
6. Révész, P., Gyimesi, J. and Zsoldos, E., J. Appl. Phys. 54 (1983) 1860.Google Scholar
7. Lien, Chuen-Der and Nicolet, Marc-A., Workshop on refractory metal silicides for VLSI, San Juan Bautista, May 1984.Google Scholar
8. Wittner, M. and Tu, K.N., Phys. Rev. B 29 (1984) 2010.Google Scholar
9. Ting, C.-Y., Wittmer, M., Tu, K.N., Proc. 1st Int. Symp. on VLSI, Detroit, 1982 (Electrochem. Soc., Pennington, 1983), p. 242.Google Scholar
10. Seidel, T., Workshop on Rapid Thermal Annealing, North Carolina, Dec. 1984.Google Scholar
11. Maex, K. and Keersmaecker, R. De, Proc. 14th European Solid State Device Research Conference, Lille, Sept. 1984, eds. Noblanc, J.P. and Zimmerman, J., to be published in Physica B.Google Scholar
12. Fair, R.B., Wortman, J.J. and Lui, J., J. Electrochem. Soc. 131 (1984) 2387.Google Scholar
13. Vanheliemont, J., Bender, H., Landuyt, J. Van, Claeys, C. and Declerck, G., Proc. 4th Oxford Conference on Microscopy of Semiconducting Materials (Institute of Physics Conference Series) 1985, to be published.Google Scholar