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Ceramic/Polymer Nanocomposite Properties for Microelectronic Packages

Published online by Cambridge University Press:  21 February 2011

Amitabh Das ,
Thallam T. Srinivasan  and
Robert E. Newnham
Amitabh Das
Affiliation:
Materials Research Laboratory, The Pennsylvania State University, University Park, PA16802.
Thallam T. Srinivasan
Affiliation:
Materials Research Laboratory, The Pennsylvania State University, University Park, PA16802.
Robert E. Newnham
Affiliation:
Materials Research Laboratory, The Pennsylvania State University, University Park, PA16802.
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Abstract

This paper reviews some of the research efforts in microelectronic packaging to develop composites with dimensions of the fillers ranging down to nanometer dimensions. Some initial experiments have been conducted with nanocomposites, where the thermal and dielectric properties of polymer/fumed silica composites have been studied. The bulk samples were prepared in different ratios of polymer to silica using polydimethyl siloxane and Cab-O-Sil. Differential thermal analyses carried out on these samples showed no changes in the samples till 330°C. The dielectric constant of the 70:30 (Cab-O-Sil- Polymer by Wt.%) composite is 3.8, similar to that of the pure silica. For the same composite the value of the thermal expansion coefficient is 350 ppm, closer to the value of pure polymer (439 ppm). It is suggested that the key to model these nanocomposites with ceramic and polymer phases is to understand the interfaces and their chemical bonding.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 165
Copyright
Copyright © Materials Research Society 1990

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