Hostname: page-component-5c6d5d7d68-sv6ng Total loading time: 0 Render date: 2024-09-01T09:20:54.807Z Has data issue: false hasContentIssue false
  • English
  • Français

Barrier Effect on Electroplated Cu Films

Published online by Cambridge University Press:  10 February 2011

R. Faust  and
Q. Jiang
R. Faust
Affiliation:
SSEMATECH, 2706 Montopolis Drive, Austin, TX 78741–6499 Texas Instruments, 13570 N. Central Expressway, Dallas, TX 75243
Q. Jiang
Affiliation:
National Semiconductor, 2900 Semiconductor Drive, Santa Clara, CA 95052–8090
Get access

Abstract

The effect of various barrier materials on the microstructure of electroplated Copper films was investigated. Analysis of the Cu was performed at the as-deposited, room temperature stabilized, and annealed states. It shows that the barrier material can have a dramatic effect on the properties of electroplated Cu.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 564: Symposium N – Advanced Interconnects and Contacts , 1999 , 421
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ritzdorf, T., Graham, L., S Jin, Mu, C., and Fraser, D., “Proceedings of the International Interconnect Technology Conference”, IEEE, 1998, pp. 166–168.Google Scholar
2. Jiang, Qing-Tang, Mikkola, Robert, Carpenter, Brad, and Thomas, Michael E., Adv. Metal. Conf., 1998, pp. 177–181.Google Scholar
3. Cabral, C., Andricacos, P., Gignac, L., Noyan, I., Rodbell, K., Shaw, T., Rosenberg, R., Harper, H., DeHaven, P., Locke, P., Malhotra, S., Uzoh, C., and Klepeis, S., Adv. Metal. Conf., 1998, pp. 81–87.Google Scholar
4. Lingk, C., Gross, M., Brown, W., Lai, W., Miner, J., Ritzdorf, T., Turner, J., Gibbons, K., Klawuhn, E., Wu, G., and Zhang, F., Adv. Metal. Conf., 1998 pp. 89–94.Google Scholar
5. Wong, S., Ryu, C., Lee, H., Loke, A., Kwon, K., Bhattacharya, S., Eaton, R., Faust, R., Mikkola, R., Mucha, J., and Ormando, J., IITC, 1998, pp. 107–109.Google Scholar
6. Wong, S. Simon, Ryu, Changsup, Lee, Haebum, and Kwon, Kee-Won, MRS, Vol. 514, 1998, pp. 75–81.10.1557/PROC-514-75Google Scholar
7. Jiang, Qing-Tang, Faust, Rick, Lam, Hieu“Robbie”, and Mucha, Jay, (to be presented), IEEE, International Interconnect Technology Conference, 1999.Google Scholar